Development Development of 3D XPoint began around 2012. 3D XPoint has been stated to use electrical resistance and to be bit addressable. 3D XPoint developers indicated that it was based on changes in resistance of the bulk material. According to reverse engineering firm TechInsights, 3D XPoint used germanium-antimony-tellurium (GST) with low silicon content as the data storage material, which is accessed by ovonic threshold switches (OTSes) made of ternary phased selenium-germanium-silicon with arsenic doping.
Initial production In mid-2015, Intel announced the
Optane brand for storage products based on 3D XPoint technology. Micron (using the
QuantX brand) estimated the memory to be sold for about half the price of dynamic random-access memory (DRAM), but four to five times the price of
flash memory. Initially, a
wafer fabrication facility in
Lehi, Utah, operated by
IM Flash Technologies LLC (an Intel-Micron joint venture) made small quantities of 128 Gbit chips in 2015. They stack two 64 Gbit planes. This low latency significantly increases IOPS at low queue depths for random operations. At
Intel Developer Forum 2016, Intel demonstrated
PCI Express (PCIe) 140 GB development boards showing 2.4–3× improvement in benchmarks compared to PCIe NAND flash
solid-state drives (SSDs). On March 19, 2017, Intel announced their first product: a PCIe card available in the second half of 2017.
Reception ''. Despite the initial lukewarm reception when first released, 3D XPoint – particularly in the form of Intel's Optane range – has been highly acclaimed and widely recommended for tasks where its specific features are of value, with reviewers such as
Storage Review concluding in August 2018 that for low-latency workloads, 3D XPoint was producing 500,000 4K sustained
IOPS for both reads and writes, with 3–15
microsecond latencies, and that at present "there is currently nothing [else] that comes close", while
Tom's Hardware described the Optane 900p in December 2017 as being like a "mythical creature" that must be seen to be believed, and which doubled the speed of the best previous consumer devices. ServeTheHome concluded in 2017 that in read, write, and mixed tests, Optane SSDs were consistently around 2.5× as fast as the best Intel data center SSDs that had preceded them, the P3700 NVMe.
AnandTech noted that consumer Optane-based SSDs were similar in performance to the best non-3D-XPoint SSDs for large transfers, with both being "blown away" by the large transfer performance of enterprise Optane SSDs.
Sale of Lehi fab, and discontinuation On March 16, 2021, Micron announced that it would cease development of 3D XPoint in order to develop products based on
Compute Express Link (CXL), due to a lack of demand. The Lehi fab was never fully utilized and was sold to
Texas Instruments for USD 900 million. Intel responded at the time that its ability to supply Intel Optane products would not be affected. However, Intel had already discontinued its consumer line of Optane products in January 2021. In July 2022, Intel announced the winding down of the Optane division, effectively discontinuing the development of 3D XPoint. ==Compatibility==