The projection aligner is similar to the
wafer stepper in concept, but with one key difference. The aligner uses a mask that holds the pattern for the entire wafer, which may require large masks. The stepper uses a smaller mask on the wafer repeatedly, and steps across the surface to repeat the pattern of the chip layer. This reduces mask costs dramatically and allows a single wafer to be used for different
integrated circuit layouts or mask designs in a single run. More importantly, by focusing the light source onto a single area of the wafer, the stepper can produce much higher resolutions, thus allowing for smaller features on chips (
minimum feature size). The disadvantage to the stepper is that each chip on the wafer has to be individually imaged, and thus the process of exposing the wafer as a whole is much slower. ==References==