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Buffered oxide etch

Buffered oxide etch (BOE), also known as buffered HF or BHF, is a wet etchant used in microfabrication. It is a mixture of a buffering agent, such as ammonium fluoride NH4F, and hydrofluoric acid (HF). Its primary use is in etching thin films of silicon nitride (Si3N4) or silicon dioxide (SiO2), by the reaction:

Production
Buffered oxide etch can be produced in laboratory quantities by dissolving NH4F powder into water, and adding a solution of HF. == Uses ==
Uses
A buffered oxide etch solution of 6:1 volume ratio of 40% NH4F to 49% HF will etch thermally grown oxide at approximately 2 nanometres per second at 25 degrees Celsius. HF solution buffered with can be used to provide better etching of zeolite for the creation of larger pores, to improve the characteristically poor rate of diffusion in these microporous structures. Simple HF solutions (and other acidic methods of etching) show high selectivity in removing aluminum from zeolites, reducing the number of potential Brønsted acid sites, and subsequently reducing certain catalytic performance. However, the addition of a buffer results in a solution with more HF and present, which removes Al and Si in more equal proportion. == References ==
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