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Shallow trench isolation

Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. Older CMOS technologies and non-MOS technologies commonly use isolation based on LOCOS.

Process flow
• Stack deposition (oxide + protective nitride) • Lithography print • Dry etch (Reactive-ion etching) • Trench fill with oxide • Chemical-mechanical polishing of the oxide • Removal of the protective nitride • Adjusting the oxide height to Si ==See also==
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