Electrically addressed semiconductor non-volatile memories can be categorized according to their write mechanism.
Read-only and read-mostly devices Mask ROMs are factory programmable only and typically used for large-volume products that are not required to be updated after the memory device is manufactured.
Programmable read-only memory (PROM) can be altered once after the memory device is manufactured using a
PROM programmer. Programming is often done before the device is installed in its target system, typically an
embedded system. The programming is permanent, and further changes require the replacement of the device. Data is stored by physically altering (burning) storage sites in the device. An
EPROM is an erasable ROM that can be changed more than once. However, writing new data to an EPROM requires a special programmer circuit. EPROMs have a quartz window that allows them to be erased with ultraviolet light, but the whole device is cleared at one time. A
one-time programmable (OTP) device may be implemented using an EPROM chip without the quartz window; this is less costly to manufacture. An electrically erasable programmable read-only memory
EEPROM uses voltage to erase memory. These erasable memory devices require a significant amount of time to erase data and write new data; they are not usually configured to be programmed by the processor of the target system. Data is stored using
floating-gate transistors, which require special operating voltages to trap or release electric charge on an insulated control gate to store information.
Flash memory Flash memory is a solid-state chip that maintains stored data without any external power source. It is a close relative to the EEPROM; it differs in that erase operations must be done on a block basis, and its capacity is substantially larger than that of an EEPROM. Flash memory devices use two different technologies—NOR and NAND—to map data. NOR flash provides high-speed random access, reading and writing data in specific memory locations; it can retrieve as little as a single byte. NAND flash reads and writes sequentially at high speed, handling data in blocks. However, it is slower at reading when compared to NOR. NAND flash reads faster than it writes, quickly transferring whole pages of data. Less expensive than NOR flash at high densities, NAND technology offers higher capacity for the same-sized silicon.
Ferroelectric RAM (F-RAM) Ferroelectric RAM (
FeRAM,
F-RAM or
FRAM) is a form of
random-access memory similar in construction to
DRAM, both use a capacitor and transistor but instead of using a simple
dielectric layer the capacitor, an F-RAM cell contains a thin ferroelectric film of lead zirconate titanate , commonly referred to as PZT. The Zr/Ti atoms in the PZT change polarity in an electric field, thereby producing a binary switch. Due to the PZT crystal maintaining polarity, F-RAM retains its data memory when power is shut off or interrupted. Due to this crystal structure and how it is influenced, F-RAM offers distinct properties from other nonvolatile memory options, including extremely high, although not infinite, endurance (exceeding 1016 read/write cycles for 3.3 V devices), ultra-low power consumption (since F-RAM does not require a charge pump like other non-volatile memories), single-cycle write speeds, and gamma radiation tolerance.
Magnetoresistive RAM (MRAM) Magnetoresistive RAM stores data in magnetic storage elements called
magnetic tunnel junctions (MTJs). The first generation of MRAM, such as
Everspin Technologies' 4 Mbit, utilized field-induced writing. The second generation is developed mainly through two approaches:
Thermal-assisted switching (TAS) which is being developed by
Crocus Technology, and
Spin-transfer torque (STT) which
Crocus,
Hynix,
IBM, and several other companies are developing.
Phase-change Memory (PCM) Phase-change memory stores data in
chalcogenide glass, which can reversibly change the phase between the amorphous and the
crystalline state, accomplished by heating and cooling the glass. The
crystalline state has low resistance, and the amorphous phase has high resistance, which allows currents to be switched ON and OFF to represent digital 1 and 0 states.
FeFET memory FeFET memory uses a transistor with
ferroelectric material to permanently retain state.
RRAM memory RRAM (ReRAM) works by changing the resistance across a dielectric solid-state material, often referred to as a memristor. ReRAM involves generating defects in a thin oxide layer, known as oxygen vacancies (oxide bond locations where the oxygen has been removed), which can subsequently charge and drift under an electric field. The motion of oxygen ions and vacancies in the oxide would be analogous to the motion of electrons and holes in a semiconductor. Although ReRAM was initially seen as a replacement technology for flash memory, the cost and performance benefits of ReRAM have not been enough for companies to proceed with the replacement. Apparently, a broad range of materials can be used for ReRAM. However, the discovery that the popular high-κ gate dielectric HfO2 can be used as a low-voltage ReRAM has encouraged researchers to investigate more possibilities. == Mechanically addressed systems ==