Both flexible substrate itself as well as the process of bending the device introduce
stress into the materials. There may be residual stress from the deposition of layers onto a flexible substrate, thermal stresses due to the different coefficient of
thermal expansion of materials in the device, in addition to the external stress from the bending of the device. Stress introduced into the organic layers may lower the efficiency or brightness of the device as it is deformed, or cause complete breakdown of the device altogether.
Indium tin oxide (ITO), the material most commonly used as the transparent
anode, is brittle. Fracture of the anode can occur which can increase the
sheet resistance of the ITO or disrupt the layered structure of the OLED. Although ITO is the most common and best understood anode material used in OLEDs, research has been undertaken into alternative materials that are better suited for flexible applications including
carbon nanotubes.
Encapsulation is another challenge for flexible OLED devices. The materials in an OLED are sensitive to air and moisture which lead to
degradation of the materials themselves as well as
quenching of excited states within the molecule. The common method of encapsulation for regular OLEDs is to seal the organic layer between glass. Flexible encapsulation methods are generally not as effective a barrier to air and moisture as glass, and current research aims to improve the encapsulation of flexible organic light emitting diodes. ==See also==