Power Mac G5

Officially launched as part of Steve Jobs' keynote presentation at the Worldwide Developers Conference in June 2003, the Power Mac G5 was introduced with three models, sharing the same physical case, but differing in features and performance. Although somewhat larger than the G4 tower it replaced, the necessity for a complex cooling system meant that the G5 tower had room inside for only one optical drive and two hard drives. Steve Jobs stated during his keynote presentation that the Power Mac G5 would reach 3 GHz "within 12 months." This would never come to pass; after three years, the G5 only reached 2.7 GHz before it was replaced by the Intel Xeon-based Mac Pro, which debuted with processors running at speeds of up to 3 GHz. During the presentation, Apple also showed Virginia Tech's Mac OS X computer cluster supercomputer (a.k.a. supercluster) known as System X, consisting of 1,100 Power Mac G5 towers operating as processing nodes. The supercomputer managed to become one of the top five supercomputers that year. The computer was soon dismantled and replaced with a new cluster made of an equal number of Xserve G5 rack-mounted servers, which also used the G5 chip running at 2.3 GHz. == PowerPC G5 and the IBM partnership ==

The PowerPC G5 (called the PowerPC 970 by its manufacturer, IBM) is based upon IBM's 64-bit POWER4 microprocessor. At the Power Mac G5's introduction, Apple announced a partnership with IBM in which IBM would continue to produce PowerPC variants of their POWER processors. According to IBM's Dr. John E. Kelly, "The goal of this partnership is for Apple and IBM to come together so that Apple customers get the best of both worlds, the tremendous creativity from the Apple corporation and the tremendous technology from the IBM corporation. IBM invested over US$3 billion in a new lab to produce these large, 300 mm wafers." This completely automated facility in East Fishkill, New York figured heavily in IBM's larger microelectronics strategy. The original PowerPC 970 had 50 million transistors and was manufactured using IBM CMOS 9S at 130 nm fabrication process. CMOS 9S is the combination of SOI, low-k dielectric insulation, and copper interconnect technology, which were invented at IBM research in the mid-1990s. Subsequent revisions of the "G5" processor have included IBM's PowerPC 970FX (same basic design on a 90 nm process), and the PowerPC 970MP (essentially two 970FX cores on one die). Apple refers to the dual-core PowerPC 970MP processors as either the "G5 Dual" (for single-socket, dual-core configurations), or Power Mac G5 Quad (for dual-socket, four-core configurations). == Architecture ==

The Power Mac G5 line in 2006 consisted of three, dual-core PowerPC G5 configurations, which can communicate through its HyperTransport at half its internal clock speed. Each processor in the Power Mac G5 has two unidirectional 32-bit pathways: one leading to the processor and the other from the processor. These result in a total bandwidth of up to 20 GB/s. The processor at the heart of the Power Mac G5 has a "superscalar, superpipelined" execution core that can handle up to 216 in-flight instructions, and uses a 128-bit, 162-instruction SIMD unit (AltiVec). All modern 32-bit x86 processors since the Pentium Pro have the Physical Address Extension (PAE) feature, which permits them to use a 36-bit physical memory address to address a maximum of 236 bytes (64 gigabytes) of physical memory, while the PowerPC 970 processor is capable of addressing 242 bytes (4 terabytes) of physical memory and 264 bytes (16 exabytes) of virtual memory. Due to its 64-bit processor (and 42-bit MMU), the final revision of the Power Mac G5 can hold 16 GB of Dual-Channel DDR2 PC4200 RAM using eight memory slots, with support for ECC memory. == Product revision history ==

• June 2003: Initial release at speeds of Single 1.6, Single 1.8, Dual 2.0 GHz. • November 2003: Dual 1.8 replaces Single 1.8 GHz; price reduction on Single 1.6 GHz. • June 2004: 90 nm Dual 1.8, Dual 2.0 and Dual 2.5 GHz replace all previous models. The 2.5 GHz model is notable as the first major PC with liquid cooling included as stock. • October 2004: A new Single 1.8 reintroduced, with a slower, 600 MHz HyperTransport, PCI bus, based upon the iMac G5's architecture (U3lite and Shasta chips). Apple's official name for this machine is "Power Mac G5 (Late 2004)". • April 2005: CPU speed increased: Dual 2.5 GHz → Dual 2.7 GHz (PCI-X, more reliable liquid cooling), Dual 2.0 GHz → Dual 2.3 GHz (PCI-X), Dual 1.8 GHz → Dual 2.0 GHz (PCI). Newly introduced features were the 16x dual-layer SuperDrives across the line and increased storage, up to 800 GB for the higher-end models. The 1.8 GHz Single was not modified. • June–July 2005: The Single 1.8 model was discontinued in the United States and Europe. • October 2005: Shift to dual-core processors: Dual 2.0 GHz → DC 2.0 GHz, Dual 2.3 GHz → DC 2.3 GHz, Dual 2.7 GHz → Dual DC 2.5 GHz (termed a Quad Power Mac G5, with four CPU execution cores), all with DDR2 memory, and PCI Express expansion in place of PCI-X. The older PCI-X, Dual 2.7 GHz model remained available for a while, but the slower speed single-core models were discontinued immediately. • August 2006: The Power Mac is replaced by its Intel successor, the Mac Pro. == Technical specifications ==

Early versions of dual processor G5 computers have noise problems. The first one is ground loop-based interference, which sometimes causes noise leaks into the analog audio outputs. This bug was fixed in Rev. B G5. The second noise problem came from the 'chirping' sound, which can be triggered by fluctuations in power draw. For example, using Exposé causes a brief chirp. A widely circulated work-around is to disable the CPUs' "nap" feature using Apple's CHUD Tools, but this was not recommended by Apple. This noise problem was not fixed until the dual core generation of G5s was produced, however it did not affect the "Late 2004" model (at least there have never been any reports). The power draw fluctuation was later attributed to the lack of power management features in the single-core processors. Apple eventually posted the chirping bug information on its support site. Although the noise problems did not prevent the affected computers from working, they were problematic for audio professionals and enthusiasts, especially for the liquid-cooled models, which had been expressly designed as mechanically quiet for discerning listeners. A common problem among single processor G5s was the cyclic expansion and contraction of a metal plate soldered to the Logic Board connecting all eight of the RAM slots. Eventually, this can cause the computer to no longer detect the RAM, and refuse to boot. Fixes for this include having the plate re-soldered, or exposing the other side of the Logic Board to heat from a heat gun. The latter option is far easier, since it requires neither soldering nor the removal of the Logic Board from the computer. All 2.5 GHz and 2.7 GHz dual processor models and the 2.5 GHz quad-processor model had a liquid cooling system that consisted of a radiator, coolant pump, and heat exchangers bolted to the processors. The cooling system was made by Delphi Automotive, a former Harrison Radiator Division of General Motors. This was a bold step for Apple, and should have allowed the use of very fast processors, giving Apple an advantage in both performance and reliability, but the system turned out to be subject to coolant leakage, made worse by the system's use of GM Dexcool coolant, which is more corrosive than regular automotive coolant. If not caught in time, the leakage could destroy the processors, logic board, power supply unit, and even corrode the aluminum casing itself. While leakage was sometimes detectable by drops of green coolant in or beneath the machine, in many machines the seepage is so slight that it was almost impossible to detect without dismantling the entire computer. Only the 2.7 GHz model was equipped with a Panasonic liquid cooling system which was much more reliable. The liquid cooling system fits into the case where the heat sinks would normally go, so there is no easy way to distinguish the liquid-cooled versions from the air-cooled, although most, but not all, of the liquid-cooled machines have a sticker inside warning about the possibility of leakage. == Supported operating systems ==