Skiving is also used for the manufacturing of
heat sinks for PC cooling products. A PC cooler created by skiving has the benefit that the heat sink base and fins are created from a single piece of material (copper or aluminum), providing improved heat dissipation and heat transfer from base to fins. Additionally, the skiving process also increases the roughness of the fins. Unlike the underside of a heat sink, which needs to be smooth for maximum contact area with the heat source, the fins benefit from this roughness because it increases the fins' surface area on which to dissipate heat into the air. The fins may be made much thinner and closer together than by
extrusion or formed sheet processes, which can offer greater heat transfer in high-performance
waterblocks for
water cooling. ==See also==