4:["$","div",null,{"className":"min-h-screen bg-white flex flex-col","children":[["$","div",null,{"className":"px-6 pt-6 pb-4 border-b border-gray-100","children":[["$","div",null,{"className":"flex items-center gap-1.5 text-xs text-gray-400 mb-4","children":[["$","a",null,{"href":"/","className":"hover:text-[#26a69a] transition-colors","children":"Market"}],["$","span",null,{"children":"›"}],["$","span",null,{"className":"text-gray-600","children":"Thin small outline package"}]]}],["$","div",null,{"className":"text-[10px] text-gray-400 uppercase tracking-widest mb-1","children":"Company Profile"}],["$","h1",null,{"className":"text-2xl font-bold text-gray-900","children":"Thin small outline package"}],null]}],["$","div",null,{"className":"flex-1 px-6 py-6","children":[["$","p",null,{"className":"text-sm text-gray-600 leading-relaxed mb-8","children":"Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile and have tight lead spacing."}],["$","div",null,{"className":"columns-1 md:columns-2 gap-10","children":[["$","div","0",{"className":"mb-8 break-inside-avoid","children":[["$","div",null,{"className":"text-xs font-semibold text-gray-400 uppercase tracking-wide mb-3 border-b border-gray-100 pb-1","children":"History"}],["$","div",null,{"className":"text-sm text-gray-600 leading-relaxed wiki-content","dangerouslySetInnerHTML":{"__html":"The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card. ==Physical properties=="}}]]}],["$","div","1",{"className":"mb-8 break-inside-avoid","children":[["$","div",null,{"className":"text-xs font-semibold text-gray-400 uppercase tracking-wide mb-3 border-b border-gray-100 pb-1","children":"Physical properties"}],["$","div",null,{"className":"text-sm text-gray-600 leading-relaxed wiki-content","dangerouslySetInnerHTML":{"__html":"39F1601 W982516BH75L TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. Type I Type II == HTSOP =="}}]]}],["$","div","2",{"className":"mb-8 break-inside-avoid","children":[["$","div",null,{"className":"text-xs font-semibold text-gray-400 uppercase tracking-wide mb-3 border-b border-gray-100 pb-1","children":"HTSOP"}],["$","div",null,{"className":"text-sm text-gray-600 leading-relaxed wiki-content","dangerouslySetInnerHTML":{"__html":"HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side. The pad is soldered to the PCB to transfer heat from the package to the PCB. ==Similar packages=="}}]]}],["$","div","3",{"className":"mb-8 break-inside-avoid","children":[["$","div",null,{"className":"text-xs font-semibold text-gray-400 uppercase tracking-wide mb-3 border-b border-gray-100 pb-1","children":"Similar packages"}],["$","div",null,{"className":"text-sm text-gray-600 leading-relaxed wiki-content","dangerouslySetInnerHTML":{"__html":"There are a variety of small form-factor IC carrier available other than TSOPs • Small-outline integrated circuit (SOIC) • Plastic small-outline package (PSOP) • Shrink small-outline package (SSOP) • Thin-shrink small outline package (TSSOP) ==See also=="}}]]}]]}],["$","div",null,{"className":"mt-8 pt-4 border-t border-gray-100","children":"$Lf"}]]}],"$L10"]}]