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Solder ball

In integrated circuit packaging, a solder ball, also known as a solder bump is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps, since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.

Underfill
After the solder balls are used to attach an integrated circuit chip to a printed circuit board (PCB), often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of solder balls—for example, one layer of solder balls attaching a flip chip to an interposer to form a BGA package, and a second layer of solder balls attaching that interposer to the PCB. Often both layers are underfilled. ==Usage in flip chip method==
Usage in flip chip method
Image:Flip chip pads.svg|Pads Image:Flip chip flipped.svg|Balls Image:Flip chip mount 1.svg|Alignment Image:Flip chip mount 2.svg|Contact Image:Flip chip mount 3.svg|Solder reflow Image:Flip chip mount underfill.svg|Adhesive underfill Image:Flip chip mount final.svg|Final result ==See also==
Source: Wikipedia ↗
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