Early work used lead-lead oxide-lead (Pb-PbO-Pb) tunnel junctions; for example, the experimental discovery of the Josephson effect was made on such junctions.
Lead has a superconducting critical temperature of 7.2 K, and so a lead-oxide-lead junction can operate in liquid helium at 4.2K. However, a lead junction is unstable; it fails after a few, often only one, thermal cycles between the operation temperature of 4.2 K and room temperature. To improve junction stability, researchers at IBM added small amounts of indium (In) and gold (Au) to lead, creating a tunnel junction that was more stable than the one made of pure lead, but still far from the desired performance. Additionally, processing steps tolerated by such soft junctions are limited. As a result of all these problems, lead and lead-alloy soft junctions are no longer used to make STJs. Instead, since the early to mid-1980s, superconducting electronics have used refractory (hard-metal-based) tunnel junctions based on
niobium. The process of device fabrication varies depending on the desired properties. In most cases, fabrication aims to create tunnel junctions that will be superconducting in a helium bath at 4.2 K. In that case, ever since 1983, everyone has universally used a technology developed in the early 1980s at AT&T Bell Labs. This technology is described in more detail in the sections "SIS tunnel junctions" and "Fabrication" of the article "
Josephson Junctions". Here, we provide a shortened version of that description. Device fabrication starts with the formation of a uniform trilayer structure of Nb/Al-oxide/Nb, which covers the entire substrate, typically a silicon wafer, sometimes oxidized. All metal layers are typically deposited by
sputtering. After the formation of the Nb/Al base structure (where Nb is a 100-150 nm metal film covered with a very thin (typically 5 nm) layer of aluminum), it is exposed for a few minutes to pure oxygen at a reduced (below atmospheric) pressure, all without opening the deposition chamber. This base (Nb/Al-oxide) structure is then covered by a second niobium electrode (called the counter-electrode) of comparable thickness to the first, all within the same system. Care must be taken to prevent the structure from overheating; often, water cooling is used to lower the temperature during deposition. The resulting S'IS sandwich uniformly covers the entire silicon wafer. Here, S' denotes the bottom electrode, which consists of an Nb/Al double layer; "I" denotes thin (typically around 1 nm) tunneling aluminum oxide; and S denotes the second Nb electrode. The role of Al is to replace troublesome niobium oxide with the proven, reliable aluminum tunneling oxide, Al2O3. This substitution works so well because, as was shown at Bell Labs in the early 1980s, even extremely thin aluminum overlayers tend to completely cover, "wet" the niobium surface. The small thickness of low-Tc aluminum enables its superconductivity, induced by the relatively high-Tc niobium via the well-known
proximity effect After the formation of the trilayer structure, it can be processed to form superconducting circuits and Josephson junctions (JJs). This processing varies, but the initial process developed in the early 1980s at AT&T Bell Labs by Gurvitch and co-workers still underpins all existing techniques. Over the years, the initial trilayer process has been refined into a sophisticated multilayer process on par with silicon
integrated circuit technology. And yet the main steps in Nb/Al-oxide/Nb junction preparation are essentially the same as they were over forty years ago -- an uncommon technological longevity that speaks to the basic simplicity and naturalness of the original Nb/Al-oxide/Nb trilayer process. An explanatory note is in order: why couldn't Nb-oxide-Nb structures be used? This structure cannot be used because Nb forms a poor, mixed, unstable tunneling oxide, and depositing a second Nb electrode tends to destroy it and short-circuit the junction. Another reason is the high dielectric constant of Nb2O5, so that even if one succeeded in making Nb-oxide-Nb junctions, they would be, for that reason alone, inferior to Nb/Al-oxide/Nb junctions in digital applications. The benefits obtained in the trilayer whole-wafer process are numerous. The resulting Josephson junctions are uniform, reproducible, and very reliable. In particular, they are completely immune to repeated thermal cycling between 4.2 K and room temperature. The quality of junction characteristics approaches that of the theoretical ideal (see the figure above, which depicts an idealized SIS Josephson junction characteristic). The dielectric constant of the tunneling dielectric layer -- which, as was confirmed in detailed studies, is composed of aluminum oxide Al2O3 -- is low, which is beneficial in digital applications. The same process was used for some time in
Quantum Computing, where scientists employed Josephson junctions and SQUIDs (loops with two Josephson junctions) to create
qubits. However, since the operating temperature of quantum circuits is only a few millikelvins, superconducting niobium (Tc = 9.2 K) is no longer required; pure aluminum, which superconducts below 1.2 K, is sufficient. Although earlier quantum circuits were fabricated with trilayer technology, in the last decade, quantum scientists have been fabricating superconducting qubits using simpler Al-oxide-Al structures. However, in all other applications, Nb/Al-oxide/Nb structures are ubiquitous. == Applications ==