The vacuum environment may serve one or more purposes: • reducing the particle density so that the
mean free path for collision is long • reducing the particle density of undesirable atoms and molecules (contaminants) • providing a low pressure plasma environment • providing a means for controlling gas and vapor composition • providing a means for mass flow control into the processing chamber. Condensing particles can be generated in various ways: • thermal
evaporation •
sputtering •
cathodic arc vaporization •
laser ablation • decomposition of a chemical vapor precursor,
chemical vapor deposition In reactive deposition, the depositing material reacts either with a component of the gaseous environment (Ti + N → TiN) or with a co-depositing species (Ti + C → TiC). A plasma environment aids in activating gaseous species (N2 → 2N) and in decomposition of chemical vapor precursors (SiH4 → Si + 4H). The plasma may also be used to provide ions for vaporization by sputtering or for bombardment of the substrate for sputter cleaning and for bombardment of the depositing material to densify the structure and tailor properties (
ion plating). == Types ==