Winbond was established in 1987 in
Hsinchu Science Park in Taiwan. Its founder came from the
Industrial Technology Research Institute. From 1987 to 1988 J.J Pan and Partners designed and constructed a
fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch
wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant. In 1992 Winbond joined the Precision
RISC Organization and licensed
HP's
PA-RISC architecture to design and manufacture chips for
X terminals and printers. Winbond acquired affiliated chipset maker
Symphony Laboratories, of
San Jose, California, in October 1995. Winbond was affected by power cuts caused by the
1999 Jiji earthquake forcing the company to pause manufacturing. By 2002 Winbond had 4,000 employees. In August 2004,
Infineon announced a deal with Winbond to build a factory to make DRAM. The computer IC,
consumer electronics IC, and logic product foundry divisions of Winbond were spun off as
Nuvoton Technology Corporation on 1 July 2008. In 2010 Winbond was manufacturing
DDR2 DRAM using technology licensed from
Qimonda. In 2019
Karamba Security partnered with Winbond to make secure embedded flash products. In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium. ==See also==