Broadwell (microarchitecture)

Broadwell has been launched in three major variants: • BGA package: • Broadwell-Y: system on a chip (SoC); 4.5 W and 3.5 W thermal design power (TDP) classes, for tablets and certain ultrabook-class implementations. GT2 GPU was used, while maximum supported memory is 8 GB of LPDDR3-1600. TSX instructions are disabled in this series of processors because a bug that cannot be fixed with a microcode update exists. • Broadwell-U: SoC; two TDP classes15 W for 2+2 and 2+3 configurations (two cores with a GT2 or GT3 GPU) as well as 28 W for 2+3 configurations. These are scheduled for Q2 2015. • LGA 2011-1 socket: • Broadwell-EX: Brickland platform, for mission-critical servers. Intel QuickPath Interconnect (QPI) is expected to be updated to version 1.1, enabling seamless scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be DDR3-1600 and DDR4-1866. Up to 24 core and 48 threads, up to 60 MB of L3 cache and 32 PCI Express 3.0 lanes, with 115–165 W TDP. • LGA 2011-v3 socket: • Broadwell-EP: to be marketed as Xeon E5-2600 v4 etc., while using the C610 Wellsburg chipset platform. Up to 22 cores and 44 threads, up to 55 MB of total cache and 40 PCI Express 3.0 lanes, with 55–160 W TDP classes. Maximum supported memory speed is quad-channel DDR4-2400. • Broadwell-E: HEDT platform, for enthusiasts. Announced at Computex 2016, it was released in July that year. Consisting of four processors: the 6800K, 6850K, 6900K, and the deca-core 6950X, with clock speeds ranging from 3 GHz to 4 GHz as well as up to 25 MB of L3 cache. == Architecture changes compared to Haswell ==

Unusually for a "tick", Broadwell introduces some instruction set architecture extensions not present in earlier versions of the Haswell microarchitecture: CPU • Instruction • Intel ADX: ADOX and ADCX for improving performance of arbitrary-precision integer operations • RDSEED for generating 16-, 32- or 64-bit random numbers from a thermal noise entropy stream, according to NIST SP 800-90B and 800-90C • PREFETCHW instruction • Transactional Synchronization Extensions (except for Broadwell-Y due hardware bug) GPU • Gen 8 (From Gen 7.5) • Up to 48 Execution Units (from 40) • VP8 hardware decoding and hybrid encoding • HEVC hybrid decoding • Two independent bit stream decoder (BSD) rings to process video commands on GT3 GPUs, allows one BSD ring to process decoding and the other BSD ring to process encoding at the same time. • Direct3D 12 • OpenGL 4.4 (OpenGL 4.6 on Linux) • OpenCL 2.0. I/O • 90 series chipset: H97 and Z97 • Add PCIe M.2 support (only H97 and Z97) All versions of Haswell except for the Haswell-EX variants has been fixed with a new CPU stepping level.Erratum: In fact, among Broadwell i3, i5 and i7 CPUs, only four of them support TSX instructions (i7 5650U and 5600U, i5 5350U and 5300U); it is not even precised on Intel's website whether i5 5200U does support TSX instructions. == List of Broadwell processors ==

Desktop processors "Broadwell-E" HEDT (14 nm) Embedded processors Mobile processors Core M Ultra Low Power Mobile Processors When a cooler or quieter mode of operation is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the nominal mode. This is the processor's rated frequency and TDP. When extra cooling is available, this mode specifies a higher TDP and higher guaranteed frequency versus the nominal mode. Server processors SoC processors Server CPUs Single/dual socket CPUs • Socket: LGA 2011-3 Just like Haswell-EP, the Broadwell-EP Xeon E5 has three different die configurations. The largest die (454 mm2), and highest core count (16 - 22) SKUs still work with a two-ring configuration connected by two bridges. The second configuration supports 12 to 15 cores and is a smaller version (306mm2). These dies still have two memory controllers. The smallest 10-core die uses only one dual ring, two columns of cores, and only one memory controller. • Interface: PCIe 3.0 == Roadmap and history ==

On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013. Krzanich also claimed that the chips would ship by the end of 2013; however, the shipment was delayed due to low yields from Intel's 14 nm process. On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This would coincide with the release of Intel's 9-series chipset, which would be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket. On May 18, 2014, Reuters quoted Intel's CEO promising that Broadwell-based PCs would be on shelves for the holiday season, but probably not for the back-to-school shopping. Mobile CPUs were expected in Q4 2014 and high-performance quad-core CPUs in 2015. The mobile CPUs would benefit from the reduced energy consumption of the die shrink. On June 18, 2014, Intel told CNET that while some specialized Broadwell-based products would be out in Q4 2014, "broader availability" (including mobile CPUs) would only happen in 2015. , Broadwell CPUs were available to Intel's hardware partners in sample quantities. Intel was expected to release 17 Broadwell U series family microprocessors at CES 2015. Also, according to a leak posted on vr-zone, Broadwell-E chips would be available in 2016. On August 11, 2014, Intel unveiled formally its 14 nm manufacturing process, and indicated that mobile variants of the process would be known as Core M products. Additionally, Core M products were announced to be shipping during the end of 2014, with desktop variants shipping shortly after. With Broadwell, Intel focused mainly on laptops, miniature desktops, and all-in-one systems. This left traditional desktop users with no new socketed CPU options beyond fourth-generation Haswell, which first arrived in 2013. Even though the company finally introduced two Broadwell desktop chips in the summer of 2015, it launched its high-end sixth-generation Skylake CPUs very shortly thereafter. In September 2015, Kirk Skaugen, senior vice president and general manager of Intel's Client Computing Group, admitted that skipping desktops with Broadwell was a poor decision. Between the end-of-life for Windows XP in 2014 and the lack of new desktop chips, Intel had not given desktop PC users any good reasons to upgrade in 2015. On October 9, 2014, the first laptop with Broadwell Intel Core M 5Y70 CPU, Lenovo Yoga 3 Pro, was launched. On October 31, 2014, four more Broadwell based CPUs were launched belonging to Core M Family, increasing the number of launched Broadwell CPUs to seven. On January 5, 2015, 17 additional Broadwell laptop CPUs were launched for the Celeron, Pentium and Core i3, i5 and i7 series. On March 31, 2016, Intel officially launched 14 nm Broadwell-EP Xeon E5 V4 CPUs. On May 30, 2016, Intel officially launched 14 nm Broadwell-E Core i7 69xx/68xx processor family. == See also ==