Cure monitoring is, for example, an essential component for the control of the manufacturing process of
composite materials. The material, initially
liquid, at the end of the process will be
solid:
viscosity is the most important property that changes during the process. Cure monitoring relies on monitoring various physical or chemical properties.
Rheological analysis A simple way to monitor the change in viscosity, and thus, the extent of the reaction, in a curing process is to measure the variation of the
elastic modulus. To measure the
elastic modulus of a system during curing, a
rheometer can be used. \alpha = \frac {G'(t) - G'_{min}} {G'_{max} - G'_{min}} Assuming that each
bond formed during the
crosslinking releases the same amount of energy, the degree of curing, \alpha , can be defined as follows: \alpha = \frac {Q} {Q_T} = \frac {\int_{0}^{s} \dot Q\, dt} {\int_{0}^{s_f} \dot Q\, dt} where Q is the heat released up to a certain time s , \dot Q is the instantaneous rate of heat and Q_T is the total amount of heat released in s_f , when the reaction finishes. Also in this case the degree of curing goes from zero (no bonds created) to one (no more reactions occur) with a slope that changes in time and has its maximum about at half of the reaction.
Dielectrometric analysis Conventional dielectrometry is carried out typically in a parallel plate configuration of the
dielectric sensor (
capacitance probe) and has the capability of monitoring the resin cure throughout the entire cycle, from the liquid to the rubber to the solid state. It is capable of monitoring phase separation in complex resin blends curing also within a fibrous perform. The same attributes belong to the more recent development of the dielectric technique, namely microdielectrometry. Several versions of dielectric sensors are available commercially. The most suitable format for use in cure monitoring applications are the flat interdigital capacitive structures bearing a sensing grid on their surface. Depending on their design (specifically those on durable substrates) they have some reusability, while flexible substrate sensors can be used also in the bulk of the resin systems as embedded sensors.
Spectroscopic analysis The curing process can be monitored by measuring changes in various parameters: • the concentration of specific reactive resin species using
spectroscopic methods such as
FTIR &
Raman; • the
refractive index or
fluorescence of the resin (optical property); • the internal resin
strain (mechanical property) with the use of
Fiber Bragg grating (FBG) sensors.
Ultrasonic analysis Ultrasonic cure monitoring methods are based on the relationships between changes in the characteristics of propagating
ultrasound and the real-time mechanical properties of a component, by measuring: • ultrasonic time of flight, both in through-transmission and pulse-echo modes; • natural frequency using impact excitation and
laser-induced surface
acoustic wave velocity measurement. ==See also==