) and three OV6920 (1/18") image sensors, both types with
composite video (
NTSC) outputs.
OmniPixel3-HS OmniVision's front-side illumination (FSI) technology is used to manufacture compact cameras in mobile handsets, notebook computers and other applications that require low-light performance without the need for flash. OmniPixel3-GS expands on its predecessor, and is used for
eye-tracking for facial authentication, and other
computer vision applications.
OmniBSI Backside illuminated image (BSI) technology differs from FSI architectures in how light is delivered to the photosensitive area of the sensor. In FSI architectures, the light must first pass through transistors, dielectric layers, and metal circuitry. In contrast, OmniBSI technology turns the image sensor upside down and applies color filters and micro lenses to the backside of the pixels, resulting in light collection through the backside of the sensor.
OmniBSI-2 The second-generation BSI technology, developed in cooperation with Taiwan Semiconductor Manufacturing Company Limited (
TSMC), is built using custom 65 nm design rules and 300mm
copper processes. These technology changes were made to improve low-light sensitivity,
dark current, and full-well capacity and provide a sharper image.
CameraCubeChip In this
camera module, sensor and lens manufacturing processes are combined using
semiconductor stacking methodology. Wafer-level optical elements are fabricated in a single step by combining CMOS image sensors, chip scale packaging processes, (CSP) and
wafer-level optics (WLO). These fully integrated chip products have camera functionality and are intended to produce thin, compact devices.
RGB-Ir technology RGB-iR technology uses a color filter process to improve color fidelity. By committing 25% of its pixel array pattern to
infrared (IR) and 75% to RGB, it can simultaneously capture both
RGB and IR images. This makes it possible to capture both day and night images with the same sensor. It is used for battery powered home security cameras as well as
biometric authentication, such as gesture and facial recognition.
PureCel technologies OmniVision developed its PureCel and PureCel Plus image sensor technology to provide added camera functionality to smartphones and action cameras. The technical goal was to provide smaller camera modules that enable larger optical formats and offer improved image quality, especially in low-light conditions. Both of these technologies are offered in a stacked die format (PureCel-S and PureCelPlus-S). This stacked die methodology separates the imaging array from the image sensor processing pipeline into a stacked die structure, allowing for additional functionality to be implemented on the sensor while providing for much smaller die sizes compared to non-stacked sensors. PureCelPlus-S uses partial deep trench isolation (B-DTI) structures comprising an interfacial oxide, first deposited HfO, TaO, oxide, Ti-based liner, and a tungsten core. This is OmniVision's first DTI structure, and the first metal filled B-DTI trench since 2013. PureCel Plus uses buried color filter array (BCFA) to collect light with various incident light angles for tolerance improvements. Deep trench isolation reduces
crosstalk by creating isolation walls between pixels inside silicon. In PureCel Plus Gen 2, OmniVision set out to improve deep trench isolation for better pixel isolation and low-light performance. Its target application is smartphone video cameras.
Nyxel Developed to address the low-light and
night-vision performance requirements of advanced
machine vision,
surveillance, and automotive camera applications, OmniVision's Nyxel NIR imaging technology combines thick-silicon pixel architectures and careful management of the wafer surface texture to improve
quantum efficiency (QE). In addition, extended deep trench isolation helps retain modulation
transfer function without affecting the sensor's dark current, further improving
night vision capabilities. Performance improvements include image quality, extended image-detection range and a reduced light-source requirement, leading to overall lower system power consumption.
Nyxel 2 This second generation near-infrared technology improves upon the first generation by increasing the silicon thickness to improve imaging sensitivity. Deep trench isolation was extended to address issues with crosstalk without impacting
modulation transfer function. Wafer surface has been refined to improve the extended
photon path and increase photon-electron conversion. The sensor achieves 25% improvement in the invisible 940-nm
NIR light spectrum and a 17% increase in the barely visible 850-nm NIR wavelength over the first-generation technology.
LED flicker mitigation and high dynamic range High-dynamic-range (HDR) imaging relies on
algorithms to combined several image captures into one to create a higher quality image than native capture alone.
LED lighting can create a flicker effect with HDR. This is a problem for machine vision systems, such as those used in
autonomous vehicles. That is because LEDs are ubiquitous in automotive environments, from headlights to traffic lights, road signs and beyond. While the human eye can adapt to LED flickering, machine vision cannot. To mitigate this effect, OmniVision uses split-pixel technology. One large photodiode captures a scene using short exposure time. A small photodiode using long exposure simultaneously captures the LED signal. The two images are then joined in a final picture. The result is a flicker-free image. == Products ==