Because MIL-STD-1750A does not define implementation details, 1750A products are available from a wide variety of companies in the form of component, board, and system-level offerings implemented in myriad technologies, often the most advanced and exotic of their respective periods (e.g.
GaAs,
ECL,
SoS). 1750A systems often offer high levels of protection from radiation and other hazardous environments, making them particularly suited for military, aviation and space applications. Examples of MIL-STD-1750A implementations include: •
CPU Technology, Inc. CPU1750A-FB, a high performance 1750A
SOC designed to give existing applications a late life performance boost. •
Delco Systems Operations Magic V 1750 Processor •
Dynex Semiconductor MAS281. A
radiation hardened SOC implementation on a 64-pin multichip module with an optional MMU. •
GEC-Plessey RH1750, a radiation-hardened version for aerospace and space flight applications. GEC-Plessey, under its previous iteration as
Marconi Electronic Devices, also initially developed the MAS281 and MA31750A series of processors, later made available through
Dynex Semiconductor •
Honeywell HX1750, fabricated on Honeywell's Silicon on Insulator CMOS (SOI-IV) process giving radiation hardness. The HX1750 includes an FPU and peripherals on chip. •
IBM Federal Systems AP-102, a member of the
System/4 Pi Advanced Processor series (used in various roles including the USAF
F-111 avionics upgrade) • Johns Hopkins University
Applied Physics Laboratory (JHU/APL) MIL-STD-1750AAV space flight qualified processor. A multi-board
silicon on sapphire implementation specifically designed for space flight. •
Marconi Electronic Devices MIL-STD-1750A. • McDonnell-Douglas MD-281. A radiation hardened SoS three-die implementation on a 64-pin multichip module. •
Fairchild Semiconductor F9450 series. •
National Semiconductor PACE P1750A. The PACE normally runs a version of the
Data General Nova instruction set, but was adapted to run MIL-STD-1750A using new
microcode. The family includes the P1750A CPU, the P1750AE Enhanced CPU, the P1753
Memory Management Unit (MMU), the P1754 Processor Interface Chip (PIC) and the P1757ME Multi-Chip Module. This line was passed to
Performance Semiconductor and then Pyramid Semiconductor in 2003. •
Royal Aircraft Establishment Farnborough MIL-STD-1750A implementation in
AMD 2901 bit-slice technology. == Programming ==