HiSilicon develops
SoCs based on the
ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company
Huawei.
K3V2 The first well known product of HiSilicon is the K3V2 used in
Huawei Ascend D Quad XL (U9510) smartphones and
Huawei MediaPad 10 FHD7 tablets. This chipset is based on the
ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core
Vivante GC4000 GPU. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
K3V2E This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Kirin 620 • supports – USB 2.0 / 13 MP / 1080p video encode
Kirin 650, 655, 658, 659 Kirin 710 Kirin 810 and 820 • DaVinci NPU based on Tensor Arithmetic Unit • Kirin 820 supported 5G NSA & SA
Kirin 910 and 910T Kirin 920, 925 and 928 • The Kirin 920 SoC also contains an
image processor that supports up to 32-megapixel
Kirin 930 and 935 • supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode
Kirin 950 and 955 • supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP
Kirin 960 • Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6
Kirin 970 • Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7 • Cadence Tensilica Vision P6 DSP. • NPU made in collaboration with
Cambricon Technologies. 1.92T FP16 OPS.
Kirin 980 and Kirin 985 5G/4G Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology. • Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8 • Dual NPU made in collaboration with
Cambricon Technologies. Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology. • Interconnect: ARM Mali-G77 MP8, Storage UFS 3.0 • Big-Tiny Da Vinci NPU: 1x Da Vinci Lite + 1x Da Vinci Tiny }
Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology. • Interconnect • Kirin 990 4G: ARM Mali-G76 MP16 • Kirin 990 5G: ARM Mali-G76 MP16 • Kirin 990E 5G: ARM Mali-G76 MP14 • Da Vinci NPU. • Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny • Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny • Kirin 990E 5G: 1x Da Vinci Lite + 1x Da Vinci Tiny • Da Vinci Lite features 3D Cube Tensor Computing Engine (2048 FP16 MACs + 4096 INT8 MACs), Vector unit (1024bit INT8/FP16/FP32) • Da Vinci Tiny features 3D Cube Tensor Computing Engine (256 FP16 MACs + 512 INT8 MACs), Vector unit (256bit INT8/FP16/FP32)
Kirin 9000 5G/4G and Kirin 9000E, Kirin 9000L Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV)
TSMC technology (N5
node) and the first 5 nm SoC to be launched on the international market. This octa-core
system on a chip is based on the 9th Gen of the HiSilicon Kirin series and is equipped with 15.3 billion transistors in a 1+3+4 core configuration: 4 Arm Cortex-A77 CPU (1x 3.13 GHz and 3x 2.54 GHz), 4 Arm Cortex-A55 (4x 2.05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) The Kirin 9000L uses a 1+2+3 core configuration: 3 Arm Cortex-A77 (1x 3.13 GHz and 2x 2.54 GHz), 3 Arm Cortex-A55 (3x 2.05 GHz) and a 22-core Mali-G78 GPU with Kirin Gaming+ 3.0 implementation. • GPU • Kirin 9000L: ARM Mali-G78 MP22 • Kirin 9000E: ARM Mali-G78 MP22 • Kirin 9000: ARM Mali-G78 MP24 • Da Vinci NPU architecture 2.0 • Kirin 9000L: 1x Big Core + 1x Tiny Core • Kirin 9000E: 1x Big Core + 1x Tiny Core • Kirin 9000: 2x Big Cores + 1x Tiny Core
Kirin 9000S, Kirin 90x0 series The Kirin 9000S, Kirin 9000S1, and Kirin 9010 of the Kirin 9000 Hi36A0 family were the first HiSilicon-developed SoCs manufactured in high volumes in mainland China in 2023 by
SMIC. The SoC had its debut with the
Huawei Mate 60 in late 2023 with the Kirin 9000S alongside overclocked enhancements of the Kirin 9000S1 and Kirin 9010 with the Huawei Pura 70 series in early 2024. According to
Tom's Hardware, the Taishan V120 core, developed by HiSilicon, was roughly on par with AMD's Zen 3 cores from late 2020. Four of these cores were used in the 9000 series alongside four efficiency-focused
Arm Cortex-A510 cores. The SoCs are based on SMIC's
7nm technology node, referred to as "N+2". It also includes 1 Da Vinci "big" NPU core and 1 Da Vinci "small" NPU core. Kirin 9000W, a Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi only model, debuted in global markets in Q1 2024. The Kirin 9010 and Kirin 9000S1 debuted in Q2 2024, using a modified 2+6+4 core configuration with a new large Taishan core with the same configurations of medium and small cores from the Kirin 9000S with faster enhancements over the Kirin 9000S. == Smartphone modems ==