List of Intel Atom processors

===Bonnell microarchitecture=== ===="Diamondville" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading • Transistors: 47 million • Die size: 25.96 mm2 (3.27 × 7.94) • Package size: 22 mm × 22 mm ===="Pineview" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller • Transistors: 123 million (single-core), 176 million (dual-core) • Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core) • Package size: 22 mm × 22 mm Saltwell microarchitecture ===="Cedarview" (32 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (except D2500) • Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller • Package size: 22 mm × 22 mm ==Netbook processors (sub-notebook)==

===Bonnell microarchitecture=== ===="Diamondville" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading • Transistors: 47 million • Die size: 26 mm2 • Package size: 22 mm × 22 mm ===="Pineview" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB • Transistors: 123 million (single-core), 176 million (dual-core) • Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core) • Package size: 22 mm × 22 mm Saltwell microarchitecture ===="Cedarview" (32 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading • Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller • Package size: 22 × 22 mm ==MID processors/SoCs (UMPC/Smartphone/IoT)==

===Bonnell microarchitecture=== ===="Silverthorne" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading • Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x • Model Z515 supports Intel Burst Performance Technology • Uses the Poulsbo chipset. • Transistors: 47 million • Die size: 26 mm2 • Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number) ===="Lincroft" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT). • GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor. • Transistors: 140 million • Die size: 7.34 mm × 8.89 mm = 65.2526 mm2 • Package size: 13.8 mm × 13.8 × 1.0 mm • Steppings: C0 Saltwell microarchitecture ===="Penwell" (32 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading. • Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller • Package size: 12 mm × 12 × 1.0 mm • Transistors: 140 million • Die size: 65.2526 mm2 (7.34 mm x 8.89 mm) ===Silvermont microarchitecture=== ===="Merrifield" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT). • Z3480 also supports Intel Wireless Display. • Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5 • Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G • Package size: 12 mm × 12 × 1.0 mm {{cpulist|atomgfx|merrifield|model=Atom Z3460 |ark=70103|cores=2|freq=1.6 |gfxclock=400-457|l2=1 MB|mem=2 × LPDDR3-1066|vmin=|vmax=|tdp=|sock1=|date=March 2014|price=|links=1 {{cpulist|atomgfx|merrifield|model=Atom Z3480 |ark=70102|cores=2|freq=2.13|gfxclock=457-533|l2=1 MB|mem=2 × LPDDR3-1066|vmin=|vmax=|tdp=|sock1=|date=March 2014|price= ===="Moorefield" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display. • GPU (PowerVR G6430) and memory controller are integrated onto the processor die • Package size: 14 mm × 14 × 1.0 mm {{cpulist|atomgfx|moorefield|model=Atom Z3530 |ark=84072|cores=4|freq=1.33|gfxmodel=PowerVR G6430|gfxclock=457|l2=2 × 1 MB|mem=2 × LPDDR3-1600|vmin=|vmax=|tdp=|sock1=|date=H2 2014|price=|links=1 {{cpulist|atomgfx|moorefield|model=Atom Z3560 |ark=81194|cores=4|freq=1.83|gfxclock=457–533|l2=2 × 1 MB|mem=2 × LPDDR3-1600|vmin=|vmax=|tdp=|sock1=|date=H2 2014|price= {{cpulist|atomgfx|moorefield|model=Atom Z3580 |ark=81195|cores=4|freq=2.33|gfxclock=457–533|l2=2 × 1 MB|mem=2 × LPDDR3-1600|vmin=|vmax=|tdp=|sock1=|date=H2 2014|price= {{cpulist|atomgfx|moorefield|model=Atom Z3590 |ark=91319|cores=4|freq=2.50|gfxmodel=PowerVR G6430|gfxclock=457-640|l2=2 × 1 MB|mem=2 × LPDDR3-1600|vmin=|vmax=|tdp=|sock1=|date=Q3 2015|price= ===="SoFIA" (28 nm)==== • SoFIA (smart or feature phone with Intel architecture) • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs) • GPU (ARM Mali) and memory controller are integrated onto the processor die • Package size: 34 × 40 mm • SoFIA 3G SoC with Silvermont CPU • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130) • SoFIA 3G–R SoC with Silvermont CPU • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK) • SoFIA LTE (W) with Airmont CPU (Announced, but never launched) • Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445) {{cpulist|atomx3|sofia3g-r|model=Atom x3-C3200RK |ark=87531|cores=4|freq=|burst=1.1|gfxmodel=Mali 450 MP4 (quad core)|gfxclock=600|l2=1 MB|mem=1×32 LPDDR2/3 1066, 2×16 DDR3/DDR3L 1333|vmin=|vmax=|sdp=2 |sock1=|connectivity=WiFi only|date=H1 2015|price= {{cpulist|atomx3|sofia3g-r|model=Atom x3-C3230RK |ark=87461|cores=4|freq=|burst=1.1|gfxmodel=Mali 450 MP4 (quad core)|gfxclock=600|l2=1 MB|mem=1×32 LPDDR2/3 1066, 2×16 DDR3/DDR3L 1333|vmin=|vmax=|sdp=2 |sock1=|connectivity=2G/3G, GPS, Bluetooth, WiFi|date=H1 2015|price= {{cpulist|atomx3|sofia3g-r|model=Atom x3-C3295RK |ark=97134|cores=4|freq=|burst=1.1|gfxmodel=Mali 450 MP4 (quad core)|gfxclock=600|l2=1 MB|mem=1×32 LPDDR2/3 1066, 2×16 DDR3/DDR3L 1333|vmin=|vmax=|sdp=2 |sock1=VF2BGA361|connectivity=2G/3G, GPS, Bluetooth, WiFi|date=October 2016|price= ==Tablet processors/SoCs==

===Bonnell microarchitecture=== ===="Lincroft" (45 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT). • GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die page 129–130. ===Silvermont microarchitecture=== ===="Bay Trail-T" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI, TXT/TXE • Package size: 17 mm × 17 × 1.0 mm Type 4 SoC: • DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode • Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a) • Integrated Intel HD Graphics (Gen7) GPU • One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports) • One USB 2.0 controller supporting four ports • Integrated LPE audio controller • Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC • Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC: • DDR3L/L-RS single-channel memory controller supporting up to 2 GB • Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4) • Integrated Intel HD Graphics (Gen7) GPU • One USB controller supporting two USB 2.0 ports • Integrated LPE audio controller • Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC • Serial I/O supporting SPI, UART (serial port), I2C or PWM {{cpulist|silvermont|baytrail|model=Atom Z3735D |ark=80272|freq=1.33|burst=1.83|gfxclock=311-646|l2=2|mem=1 × DDR3L-1333 (64-bit)|gfxmodel=4eu|sock1=UTFCBGA1380|sdp=2.2|date=May 2014|price= ===Airmont microarchitecture=== ===="Cherry Trail-T" (14 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPID AES-NI., TXT/TXE • Package size: 17 mm × 17 × 1.0 mm Type 4 SoC: • LPDDR3 dual-channel memory controller supporting up to 8 GB • PCI Express 2.0 controller with 2 lanes • Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b) • Integrated Intel HD Graphics (Gen8) GPU • One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports • One USB xDCI controller supporting one USB 3.0 port • Integrated LPE audio controller • Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC • Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC: • DDR3L/L-RS single-channel memory controller supporting up to 2 GB • PCI Express 2.0 controller with 1 lane • Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b) • Integrated Intel HD Graphics (Gen8) GPU • One USB controller supporting three USB 2.0 ports and two HSIC ports • Integrated LPE audio controller • Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC • Serial I/O supporting SPI, UART (serial port), I2C or PWM {{cpulist|silvermont|baytrail|model=Atom x5-Z8500 |ark=85474|freq=1.44|burst=2.24|gfxclock=200-600|cores=4|l2=2|mem=2 × LPDDR3-1600|gfxmodel=12eu|tdp=2.17|sdp=2|sock1=UTFCBGA1380|date=March 2015|price=$25 |sspec1=SR27N|step1=C0|part1=FJ8066401715814 ==Embedded processors/SoCs==

===Bonnell microarchitecture=== ===="Tunnel Creek" (45 nm)==== • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x. • Package size: 22 mm × 22 mm • Steppings: B0 • Temperature range: for (E620, E640, E660, E680): 0 °C to +70 °C, for (E620T, E640T, E660T, E680T): -40 °C to +85 °C. • DDR2 single-channel memory controller supporting up to 2 GB • PCI Express 1.0a controller with 4 lanes • Display controller with LVDS and serial DVO ports • Integrated GMA600 (PowerVR) GPU • Integrated HD audio controller • Serial I/O supporting SPI ===="Stellarton" (45 nm)==== • "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x • Package size: 37.5 mm × 37.5 mm • Steppings: B0 • TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W. • Temperature range: for (E625C, E645C, E665C): 0 °C to +70 °C, for (E625CT, E645CT, E665CT): -40 °C to +85 °C. • DDR2 single-channel memory controller supporting up to 2 GB • PCI Express 1.0a controller with 4 lanes • Display controller with LVDS and serial DVO ports • Integrated GMA600 (PowerVR) GPU • Integrated HD audio controller • Serial I/O supporting SPI ===Silvermont microarchitecture=== ===="Bay Trail-I" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE • Package size: 25 mm × 27 mm • DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode • Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a) • Integrated Intel HD Graphics (Gen7) GPU • PCI Express 2.0 controller with four lanes and four root ports • Two SATA-300 ports • One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports) • One USB 2.0 controller supporting four ports • Integrated LPE and HD audio controllers • Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video • Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC • Serial I/O supporting SPI, UART (serial port), I2C or PWM {{cpulist|silvermont|baytrail|model=Atom E3805|ark=84311|cores=2|gfxclock=|iobus=PCIe 2.0|l2=1|freq=1.33|mem=1 × DDR3L-1066|tdp=3|sock1=FC-BGA 1170|date=October 2014|price=$31 {{cpulist|silvermont|baytrail|model=Atom E3825|ark=78474|cores=2|gfxclock=533|iobus=PCIe 2.0|l2=1|freq=1.33|mem=1 × DDR3L-1066|gfxmodel=4eu|tdp=6|sock1=FC-BGA 1170|date=October 2013|price=$34 |sspec1=SR1RB|step1=B3|part1=FH8065301567311 |sspec2=SR1X9|step2=D0|part2=FH8065301567313 |sspec3=SR2UJ|step3=D0|part3=FH8065301567315 |sspec4=SR3V0|step4=D1|part4=FH8065301567315 {{cpulist|silvermont|baytrail|model=Atom E3826|ark=78477|cores=2|gfxclock=533-667|iobus=PCIe 2.0|l2=1|freq=1.46|mem=2 × DDR3L-1066|gfxmodel=4eu|tdp=7|sock1=FC-BGA 1170|date=October 2013|price=$37 |sspec1=SR1RC|step1=B3|part1=FH8065301542213 |sspec2=SR1X8|step2=D0|part2=FH8065301542215 |sspec3=SR2UG|step3=D0|part3=FH8065301542217 |sspec4=SR3UW|step4=D1|part4=FH8065301542217 {{cpulist|silvermont|baytrail|model=Atom E3827|ark=78478|cores=2|gfxclock=542-792|iobus=PCIe 2.0|l2=1|freq=1.75|mem=2 × DDR3L-1333|gfxmodel=4eu|tdp=8|sock1=FC-BGA 1170|date=October 2013|price=$41 |sspec1=SR1RD|step1=B3|part1=FH8065301487916 |sspec2=SR1X7|step2=D0|part2=FH8065301487918 |sspec3=SR2UH|step3=D0|part3=FH8065301487920 |sspec4=SR3UY|step4=D1|part4=FH8065301487920 ===Airmont microarchitecture=== ===="Braswell" (14 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI. • GPU and memory controller are integrated onto the processor die • GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows). • Package size: 25 mm × 27 mm ===Goldmont microarchitecture=== ===="Apollo Lake" (14 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE • Package size: 24 mm × 31 mm • DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC • Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b) • Integrated Intel HD Graphics (Gen9) GPU • PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally • Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port) • Two USB 2.0 ports • Two SATA-600 ports (one multiplexed with USB 3.0) • Integrated HD audio controller • Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors • Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0 • Serial I/O supporting SPI, HSUART (serial port) and I2C {{cpulist|silvermont|baytrail|model=Atom x5-E3930|ark=96486|cores=2|gfxclock=400–550|iobus=PCIe 2.0|l2=2|freq=1.3|burst=1.8|mem=4 × DDR3L-18664 × LPDDR4-2133|gfxmodel=500|tdp=6.5|sock1=FC-BGA 1296|date=October 2016|price=$34|links=1 {{cpulist|silvermont|baytrail|model=Atom x5-E3940|ark=96485|cores=4|gfxclock=400–600|iobus=PCIe 2.0|l2=2|freq=1.6|burst=1.8|mem=4 × DDR3L-18664 × LPDDR4-2133|gfxmodel=500|tdp=9.5|sock1=FC-BGA 1296|date=October 2016|price=$42 {{cpulist|silvermont|baytrail|model=Atom x7-E3950|ark=96488|cores=4|gfxclock=500–650|iobus=PCIe 2.0|l2=2|freq=1.6|burst=2|mem=4 × DDR3L-18664 × LPDDR4-2400|gfxmodel=505|tdp=12|sock1=FC-BGA 1296|date=October 2016|price=$57 ===Tremont microarchitecture=== ===="Elkhart Lake" (10 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI. • GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI. • SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations. • Package size: 35 mm × 24 mm ===Gracemont microarchitecture=== "Amston Lake" (7 nm) In Q2 2024 Intel launched these cpus: Atom® x7203C, Atom® x7211RE, Atom® x7213RE, Atom® x7405C, Atom® x7433RE, Atom® x7809C, Atom® x7835RE. These processors have 2-8 cpu cores and use 6-25 watts of power. ==Server SoCs==

All Atom server processors include ECC support. ===Saltwell microarchitecture=== ===="Centerton" (32 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory. ===="Briarwood" (32 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory. ===Silvermont microarchitecture=== ===="Avoton" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory. • Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations. • Quad-core SoC peripherals include 4 × USB 2.0, 2 (C2530) or 6 (C2550) × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations. • C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations. • C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations. • Package size: 34 mm × 28 mm • Die size: 107 mm2 ===="Rangeley" (22 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory. • All models except C2x38 support Intel QuickAssist Technology (QAT, cryptography accelerator) • SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated GbE LAN (2 for C2316), 2 × UART, and 8-16 lanes of PCI Express 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations. • Package size: 34 mm × 28 mm ===Goldmont microarchitecture=== ===="Denverton" (14 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 only), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC memory. • SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE (C3538 and up) LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations. • Package size: 34 mm × 28 mm ===Tremont microarchitecture=== ===="Snow Ridge" (10 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory. • Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores. • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations. • Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT) • P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications (extended temperature range). • Package size: 47.5 mm × 47.5 mm ===="Parker Ridge" (10 nm)==== • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory. • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN (except 51xx model numbers), 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations. • Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT) • Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range. • Package size: 47.5 mm × 47.5 mm ==CE SoCs==

Single-core CE SoCs ===="Sodaville" (45 nm)==== • Package size: 27 mm × 27 mm • GPU (based on the PowerVR SGX535 from Imagination Technologies) ===="Groveland" (45 nm)==== CE4200 • Package size: ?? mm × ?? mm • 2 × 32-bit memory channels, up to DDR2-800 • GPU (based on the PowerVR SGX535 from Imagination Technologies) {{cpulist|atomgfx|groveland|model=Atom CE4257|ark=|freq=1200|gfxclock=|l2=512 KB|mult=|mem=2 × DDR2-800|vmin=|vmax=|tdp=7|sock1=FC-BGA 1283|date=|price=|links=|sspec1=SLJJT|sspec2=SLJKN|sspec3=SLK7S|sspec4=SLK9L|sspec5=SLKCL|sspec6=SLJD4 Dual-Core CE SoCs ===="Berryville" (32 nm)==== • Package size: ?? mm × ?? mm • GPU for 3D (based on the PowerVR SGX545 from Imagination Technologies) • GPU for 2D (GC300 from Vivante) ==See also==