Background Semiconductor manufacturing is an imprecise process, sometimes achieving as low as 30%
yield. Defects in manufacturing are not always fatal, and in many cases it is possible to salvage part of a failed batch of
integrated circuits by modifying performance characteristics. For example, by reducing the
clock frequency or disabling non-critical parts that are defective, the parts can be sold at a lower price, fulfilling the needs of lower-end market segments. This practice occurs throughout the semiconductor industry on products such as
CPUs,
RAM,
GPUs, and
SSDs. In 2021, when Apple launched their new Apple silicon A15 Bionic chip, they similarly gave a 5-core GPU to the iPhone 13 Pro and iPad mini 6 and a (binned) 4-core GPU to the iPhone 13.
Speed bump A
speed bump, in computer terms, is a slight increase in frequency (e.g., from 1.8 to 1.9
GHz) or a slight increase in functionality (e.g.
Intel Core i7-8700K to i7-8086K). Some time after the initial release of a product, manufacturers may choose to increase the
clock frequency of an
integrated circuit for a variety of reasons, ranging from improved yields to more conservative speed ratings (e.g., actual power consumption lower than
TDP). These models are binned as different product chipsets, which places the product into separate virtual bins in which manufacturers can designate them into lower-end chipsets with different performance characteristics.
Testing Finished products enter a machine that can test hundreds of pieces at a time, taking only a few hours to complete. Each piece can be tested to determine its highest stable
clock frequency and accompanying
voltage and
temperature while running. Therefore, it should not be assumed that higher-rated products will overclock better than lower-rated ones. The resulting variation in upper-limit overclocking potential between otherwise identical pieces of hardware results in what is known as the "silicon lottery" by computer hobbyists, where the peak stable clock speeds (typically of a CPU or GPU) are unknown until being tested after purchasing.
Voltage binning Any given electrical device will consume the least power when it gets the minimum amount of current and voltage possible. As energy conservation is often a desired trait, individual chips that are stable at lower voltage and power levels are considered better bins. Voltage binning, unlike frequency binning, has a testing procedure that has irreversible effects on the test sample including
electromigration, which limits the duration of such testing.
Core unlocking Similar to frequency binning, products may also be binned based upon the number of cores which are enabled. As with overclocking, some chips may have more cores than marketed. In some products, it may be possible for the end user to enable these cores. ==Notes==