Early history Ross Freeman,
Bernard Vonderschmitt, and
James V Barnett II—all former employees of
Zilog, an
integrated circuit and solid-state device manufacturer—co-founded Xilinx in 1984 with headquarters in
San Jose, USA. While working for Zilog, Freeman wanted to create chips that acted like a blank tape, allowing users to program the technology themselves.
Expansion From 1988 to 1990, the company's
revenue grew each year, from $30 million to $100 million. Xilinx's sales rose to $2.53 billion by the end of its fiscal year 2018. Moshe Gavrielov – an
EDA and
ASIC industry veteran who was appointed president and CEO in early 2008 – introduced targeted design platforms that combine FPGAs with
software, IP cores, boards and kits to address focused target applications. These platforms provide an alternative to costly application-specific integrated circuits (ASICs) and application-specific standard products (ASSPs). On January 4, 2018, Victor Peng, the company's COO, replaced Gavrielov as CEO.
Recent history In 2011, the company introduced the
Virtex-7 2000T, the first product based on 2.5D stacked silicon (based on
silicon interposer technology) to deliver larger FPGAs than could be built using standard monolithic silicon. Xilinx then adapted the technology to combine formerly separate components in a single chip, first combining an FPGA with
transceivers based on heterogeneous process technology to boost bandwidth capacity while using less power. According to former Xilinx
CEO Moshe Gavrielov, the addition of a heterogeneous communications device, combined with the introduction of new software tools and the Zynq-7000 line of 28 nm
SoC devices that combine an
ARM core with an FPGA, are part of shifting its position from a programmable logic device supplier to one delivering “all things programmable”. In addition to Zynq-7000, Xilinx product lines include the
Virtex, Kintex and Artix series, each including configurations and models optimized for different applications. In April 2012, the company introduced the
Vivado Design Suite - a next-generation
SoC-strength design environment for advanced electronic system designs. In May, 2014, the company shipped the first of the next generation FPGAs: the 20
nm UltraScale. In September 2017,
Amazon and Xilinx started a campaign for FPGA adoption. This campaign enables
AWS Marketplace's
Amazon Machine Images (AMIs) with associated Amazon FPGA Instances created by partners. The two companies released software development tools to simplify the creation of FPGA technology. The tools create and manage the machine images created and sold by partners. In July 2018, Xilinx acquired DeepPhi Technology, a
Chinese machine learning startup founded in 2016. In October 2018, the Xilinx Virtex UltraScale+ FPGAs and NGCodec's H.265 video encoder were used in a cloud-based video coding service using the
High Efficiency Video Coding (HEVC). The combination enables video streaming with the same visual quality as that using GPUs, but at 35%-45% lower bitrate. In November 2018, the company's Zynq UltraScale+ family of multiprocessor system-on-chips was certified to
safety integrity level (SIL) 3 HFT1 of the
IEC 61508 specification. With this certification, developers are able to use the
MPSoC platform in
AI-based safety applications of up to SIL 3, in industrial 4.0 platforms of automotive, aerospace, and AI systems. In January 2019, ZF Friedrichshafen AG (ZF) worked with Xilinx's Zynq to power its ProAI automotive control unit, which is used to enable automated driving applications. Xilinx's platform overlooks the aggregation, pre-processing, and distribution of real-time data, and accelerates the AI processing of the unit. In November 2018, Xilinx migrated its defense-grade XQ UltraScale+ products to TSMC's 16 nm
FinFET process. The products included the industry's first defense-grade heterogeneous
multi-processor SoC devices and encompassed the XQ Zynq UltraScale+
MPSoCs and RFSoCs as well as XQ UltraScale+ Kintex and Virtex FPGAs. That same month the company expanded its Alveo data center accelerator cards portfolio with the Alveo U280. The initial Alveo line included the U200 and U250, which featured 16 nm UltraScale+ Virtex FPGAs and
DDR4 SDRAM. Those two cards were launched in October 2018 at the Xilinx Developer Forum. At the Forum, Victor Peng, CEO of semiconductor design at Xilinx, and AMD CTO
Mark Papermaster, used eight Alveo U250 cards and two
AMD Epyc 7551 server CPUs to set a new world record for inference throughput at 30,000 images per second. The U280 included support for
high-bandwidth memory (HBM2) and high-performance server interconnect. In August 2019, Xilinx launched the Alveo U50, a low-profile adaptable accelerator with PCIe Gen4 support. The U55C accelerator card was launched in November 2021, designed for
HPCC and big data workloads by incorporating the
RoCE v2-based clustering solution, allowing for FPGA-based HPCC clustering to be integrated into existing data center infrastructures. In January 2019
K&L Gates, a law firm representing Xilinx sent a
DMCA cease and desist letter to an
EE YouTuber claiming
trademark infringement for featuring the Xilinx logo next to
Altera's in an educational video. Xilinx refused to reply until a video outlining the legal threat was published, after which they sent an apology e-mail. In January 2019,
Baidu announced that its new
edge acceleration computing product, EdgeBoard, was powered by Xilinx. Edgeboard is a part of the Baidu Brain AI Hardware Platform Initiative, which encompasses Baidu's open computing services, and hardware and software products for its edge
AI applications. Edgeboard is based on the Xilinx Zynq UltraScale+ MPSoC, which uses real-time processors together with programmable logic. The Xilinx-based Edgeboard can be used to develop products like smart-video security surveillance solutions, advanced-driver-assistance systems, and next-generation robots. In February 2019, the company announced two new generations of its Zynq UltraScale+ RF system on chip (RFSoC) portfolio. The device covers the entire sub-6 GHz spectrum, which is necessary for
5G, and the updates included: an extended millimeter wave interface, up to 20% power reduction in the RF data converter subsystem compared to the base portfolio, and support of
5G New Radio. The second generation release covered up to 5 GHz, while the third went up to 6 GHz. As of February, the portfolio was the only adaptable radio platform single chip that had been designed to address the industry's 5G network needs. The second announcement revealed that Xilinx and
Samsung Electronics performed the world's first
5G New Radio (NR) commercial deployment in
South Korea. The two companies developed and deployed 5G massive multiple-input, multiple-output (m-MIMO) and millimeter wave (mmWave) products using Xilinx's UltraScale+ platform. In February 2019, Xilinx introduced an HDMI 2.1 IP subsystem core, which enabled the company's devices to transmit, receive, and process up to
8K (7680 x 4320 pixels) UHD video in media players, cameras, monitors, LED walls, projectors, and
kernel-based
virtual machines. In April 2019, Xilinx entered into a definitive agreement to acquire Solarflare Communications, Inc. Xilinx became a strategic investor in Solarflare in 2017. The companies have been collaborating since then on advanced networking technology, and in March 2019 demonstrated their first joint solution: a single-chip FPGA-based 100G
NIC. The acquisition enables Xilinx to combine its FPGA, MPSoC and ACAP solutions with Solarflare's NIC technology. In August 2019, Xilinx announced that the company would be adding the world's largest FPGA - the Virtex Ultrascale+ VU19P, to the 16 nm Virtex Ultrascale+ family. The VU19P contains 35 billion transistors. In June 2019, Xilinx announced that it was shipping its first Versal chips. Using ACAP, the chips’ hardware and software can be programmed to run almost any kind of AI software. On October 1, 2019, Xilinx announced the launch of Vitis, a unified
free and open source software platform that helps developers take advantage of hardware adaptability. In 2019, Xilinx exceeded $3 billion in annual revenues for the first time, announcing revenues of $3.06 billion, up 24% from the prior fiscal year. Revenues were $828 million for the fourth quarter of the fiscal year 2019, up 4% from the prior quarter and up 30% year over year. Xilinx's communications sector represented 41% of the revenue; the industrial, aerospace and defense sectors represented 27%; the data center and test, measurement & emulation (TME) sectors accounted for 18%; and the automotive, broadcast and consumer markets contributed 14%. In August 2020,
Subaru announced the use of one of Xilinx's chips as processing power for camera images in its
driver-assistance system. In September 2020, Xilinx announced its new
chipset, the T1 Telco Accelerator card, that can be used for units running on an open RAN 5G network. On October 27, 2020,
AMD reached an agreement to acquire Xilinx in a
stock-swap deal, valuing the company at $35 billion. The deal was expected to close by the end of 2021. Their stockholders approved the acquisition on April 7, 2021. The deal was completed on February 14, 2022. Since the acquisition was completed, all Xilinx products are co-branded as
AMD Xilinx; started in June 2023, all Xilinx's products are now being consolidated under AMD's branding. In December 2020, Xilinx announced they were acquiring the assets of Falcon Computing Systems to enhance the
free and open source Vitis platform, a design software for adaptable processing engines to enable highly optimized domain specific accelerators. In April 2021, Xilinx announced a collaboration with
Mavenir to boost cell phone tower capacity for open
5G networks. That same month, the company unveiled the Kria portfolio, a line of small form factor
system-on-modules (SOMs) that come with a pre-built software stack to simplify development. In June, Xilinx announced it was acquiring German software developer Silexica, for an undisclosed amount. ==Technology==