The capabilities of the TEM can be further extended by additional stages and detectors, sometimes incorporated on the same microscope.
Scanning TEM A TEM can be modified into a
scanning transmission electron microscope (STEM) by the addition of a system that rasters a convergent beam across the sample to form the image, when combined with suitable detectors. Scanning coils are used to deflect the beam, such as by an electrostatic shift of the beam, where the beam is then collected using a current detector such as a
Faraday cup, which acts as a direct electron counter. By correlating the electron count to the position of the scanning beam (known as the "probe"), the transmitted component of the beam may be measured. The non-transmitted components may be obtained either by beam tilting or by the use of
annular dark field detectors. or
liquid helium temperatures. This allows imaging specimens prepared in
vitreous ice, the preferred preparation technique for imaging individual molecules or
macromolecular assemblies, imaging of vitrified solid-electrolye interfaces, and imaging of materials that are volatile in high vacuum at room temperature, such as sulfur. For many quantum materials or devices, low temperature or ultra-low temperature is required to access phases where emergent quantum behavior occurs.
Environmental/in-situ TEM In-situ experiments may also be conducted in TEM using differentially pumped sample chambers, or specialized holders. Types of in-situ experiments include studying nanomaterials, biological specimens, chemical reactions of molecules,
liquid-phase electron microscopy, and material deformation testing.
High temperature in-situ TEM Many phase transformations occur during heating. Additionally, coarsening and grain growth, along with other diffusion-related processes occur more rapidly at elevated temperatures, where kinetics are improved, allowing for the observation of related phenomena under transmission electron microscopy within reasonable time scales. This also allows for the observation of phenomena that occur at elevated temperatures and disappear or are not uniformly preserved in ex-situ samples. High temperature TEM introduces various additional challenges which must be addressed in the mechanics of high temperature holders, including but not limited to drift-correction, temperature measurement, and decreased spatial resolution at the expense of more complex holders. Sample drift in the TEM is linearly proportional to the temperature differential between the room and holder. With temperatures as high as 1500C in modern holders, samples may experience significant drift and vertical displacement (bulging), requiring continuous focus or stage adjustments, inducing resolution loss and mechanical drift. Individual labs and manufacturers have developed software coupled with advanced cooling systems to correct for thermal drift based on the predicted temperature in the sample chamber These systems often take 30 min-many hours for sample shifts to stabilize. While significant progress has been made, no universal TEM attachment has been made to account for drift at elevated temperatures. Similarly, a research group in Germany utilized X-ray diffraction to measure slight shifts in lattice spacing caused by changes in temperature to back calculate the exact temperature in the holder. This process required careful calibration and exact TEM optics. Other examples include the use of EELS to measure local temperature using change of gas density, and resistivity changes.
In-situ mechanical TEM High resolution of TEM allows for monitoring the sample in question on a length scale ranging from hundreds of nanometres to several angstroms. This allows for the visualization of both elastic and
plastic deformation via strain fields as well as the motion of
crystallographic defects such as lattice distortions and
dislocation motion. By simultaneously observing deformation phenomena and measuring mechanical response in situ, it is possible to connect nano-mechanical testing information to models that describe both the subtlety and complexity of how materials respond to stress and strain. The material properties and data accuracy obtained from such nano-mechanical tests is largely determined by the mechanical straining holder being used. Current straining holders have the ability to perform
tensile tests,
nano-indentation, compression tests, shear tests and bending tests on materials.
Classical mechanical holders One of the pioneers of classical holders was Heinz G.F. Wilsdorf, who conducted a tensile test inside a TEM in 1958. In a typical experiment, electron transparent TEM samples are cut to shape and glued to a deformable grid. Advances in
micromanipulators have also enabled the tensile testing of
nanowires and
thin films. The deformable grid attaches to the classical tensile holder which stretches the sample using a long rigid shaft attached to a worm
gear box actuated by an electric motor located in a housing outside the TEM. Typically strain rates range from 10 nm/s to 10 μm/s. Custom-made holders expanding simple straining actuation have enabled bending tests using a bending holder and shear tests using a shear sample holder. The typical measured sample properties in these experiments are
yield strength,
elastic modulus,
shear modulus,
tensile strength,
bending strength, and
shear strength. In order to study the temperature-dependent mechanical properties of TEM samples, the holder can be cooled through a
cold finger connected to a liquid nitrogen reservoir. For high temperature experiments, the TEM sample can also be heated through a miniaturized furnace or a laser that can typically reach 1000 °C.
Nano-indentation holders Nano-Indentation holders perform a
hardness test on the material in question by pressing a hard tip into a polished flat surface and measuring the applied force and the resulting displacement on the TEM sample through a change in
capacitance between a reference and a movable electrostatic plate attached to the tip. The typical measured sample properties are
hardness and
elastic modulus. Although nano-indentation was possible since early 1980s, its investigation using a TEM was first reported in 2001 where an aluminum sample deposited on a silicon wedge was investigated. For nanoindentation experiments, TEM samples are typically shaped as wedges using a tripod polisher, H-bar window or a micro-nanopillar using
focused ion beam to create enough space for a tip to be pressed at the desired electron transparent location. The indenter tips are typically flat punch-type, pyramidal, or wedge shaped elongated in the z-direction. Pyramidal tips offer high precision on the order of 10 nm but suffer from sample slip, while wedge indenters have greater contract to prevent slipping but require finite element analysis to model the transmitted stress since the high contact area with the TEM sample makes this almost a compression test.
Micro electro-mechanical systems (MEMs) Micro Electro-Mechanical Systems (MEMs) based holders provide a cheap and customizable platform to conduct mechanical tests on previously difficult samples to work with such as micropillars, nanowires, and thin films. Passive MEMs are used as simple push to pull devices for in-situ mechanical tests. Typically, a nano-indentation holder is used to apply a pushing force at the indentation site. Using a geometry of arms, this pushing force translates to a pulling force on a pair of tensile pads to which the sample is attached. Thus, a compression applied on the outside of the MEMs translates to a tension in the central gap where the TEM sample is located. The resulting force-displacement curve needs to be corrected by performing the same test on an empty MEMs without the TEM sample to account for the
stiffness of the empty MEMs. The dimensions and stiffness of the MEMs can be modified to perform tensile tests on different sized samples with different loads. To smoothen the actuation process, active MEMs have been developed with built-in
actuators and
sensors. These devices work by applying a stress using electrical power and measuring strain using
capacitance variations. Electrostatically actuated MEMs have also been developed to accommodate very low applied forces in the 1–100 nN range. Much of current research focuses on developing sample holders that can perform mechanical tests while creating an environmental stimulus such as temperature change, variable strain rates, and different gas environments. In addition, the emergence of high resolution detectors are allowing to monitor dislocation motion and interactions with other defects and pushing the limits of sub-nanometre strain measurements. In-situ mechanical TEM measurements are routinely coupled with other standard TEM measurements such as
EELS and
XEDS to reach a comprehensive understanding of the sample structure and properties.
Aberration corrected TEM Modern research TEMs may include
aberration correctors, or by installation of an ultrafast beam blanker. This approach is termed ultrafast transmission electron microscopy when
stroboscopic pump-probe illumination is used: an image is formed by the accumulation of many ultrashort electron pulses (typically of hundreds of femtoseconds) with a fixed time delay between the arrival of the electron pulse and the sample excitation. On the other hand, the use of single or a short sequence of electron pulses with a sufficient number of electrons to form an image from each pulse is called dynamic transmission electron microscopy. Temporal resolution down to hundreds of femtoseconds and spatial resolution comparable to that available with a
Schottky field emission source is possible in ultrafast TEM. Using the Photon-gating approach, the temporal resolution in ultrafast electron microscope reaches to 30-fs allowing the imaging of ultrafast atomic and electron dynamics of matter. However, the technique can only image reversible processes that can be reproducibly triggered millions of times. Dynamic TEM can resolve irreversible processes down to tens of nanoseconds and tens of nanometres. The technique has been pioneered at the early 2000s in laboratories in Germany (
Technische Universität Berlin and
Lawrence Livermore National Laboratory ). Ultrafast TEM and Dynamic TEM have made possible real-time investigation of numerous physical and chemical phenomena at the nanoscale. An interesting variant of the Ultrafast Transmission Electron Microscopy technique is the
Photon-Induced Near-field Electron Microscopy (PINEM). The latter is based on the inelastic coupling between electrons and photons in presence of a surface or a nanostructure. This method allows one to investigate time-varying nanoscale electromagnetic fields in an electron microscope, as well as dynamically shape the wave properties of the electron beam. == Limitations ==