All processors are listed in chronological order. ===The
4-bit processors=== ====
Intel 4004 ==== First commercially available
microprocessor (single-chip IC processor) • Introduced November 15, 1971 • Clock rate 740
kHz • 0.07
MIPS • Bus width: 4 bits (five-way multiplexed address/data due to limited pins) •
PMOS • 2,300 transistors at 10
μm •
Addressable memory 640
bytes •
Program memory 4
KB (4096 B) • Originally designed to be used in
Busicom calculator
MCS-4 family: • 4004 –
CPU • 4001 – 256 byte
ROM & 4-bit Port • 4002 – 320 bit
RAM & 4-bit Port • 4003 – 10-bit Shift Register • 4008 – Memory+I/O Interface • 4009 – Memory+I/O Interface • 4211 – General Purpose Byte I/O Port • 4265 – Programmable General Purpose I/O Device • 4269 – Programmable Keyboard Display Device • 4289 – Standard Memory Interface for MCS-4/40 • 4801 – 5.185 MHz Clock Generator Crystal for 4004/4201A or 4040/4201A ====
Intel 4040 ==== • Introduced in 1974 by Intel • Clock speed was 740 kHz (same as the 4004 microprocessor) • 3,000 transistors • Interrupt features were available • Programmable memory size: 8 KB (8192 B) • 640 bytes of data memory • 24-pin DIP ===The
8-bit processors=== ====
8008==== • Introduced April 1, 1972 • Clock rate 500 kHz (8008-1: 800 kHz) • 0.05 MIPS • Bus width: 8 bits (triple-multiplexed address/data due to limited pins) • Enhancement load
PMOS logic • 3,500 transistors at 10 μm • Addressable memory 16 KB • Typical in early 8-bit microcomputers, dumb terminals, general calculators, bottling machines • Developed in tandem with 4004 • Originally intended for use in the
Datapoint 2200 microcomputer • Key volume deployment in Texas Instruments 742 microcomputer in >3,000 Ford dealerships ====
8080==== • Introduced April 1, 1974 • Clock rate 2 MHz (very rare 8080B: 3 MHz) • 0.29 MIPS • Data bus width: 8 bits, address bus: 16 bits • Enhancement load
NMOS logic • 4,500 transistors at 6 μm •
Assembly language downward compatible with 8008 • Addressable memory 64 KB (64 × 1024 B) • Up to 10× the performance of the 8008 • Used in the
Altair 8800,
traffic light controller,
cruise missile • Required two support chips versus 20 for the 8008 ====
8085==== • Introduced March 1976 • Clock rate 3 MHz • 3003 – Look-ahead Carry Generator • 3205 – High-performance 1 of 8 Binary Decoder • 3207 – Quad Bipolar-to-MOS Level Shifter and Driver • 3208 – Hex Sense Amp and Latch for MOS Memories • 3210 – TTL-to-MOS Level Shifter and High Voltage Clock Driver • 3211 – ECL-to-MOS Level Shifter and High Voltage Clock Driver • 3212 – Multimode Latch Buffer • 3214 – Interrupt Control Unit • 3216 – Parallel, Inverting Bi-Directional Bus Driver • 3222 – Refresh Controller for 4K (4096 B) NMOS DRAMs • 3226 – Parallel, Inverting Bi-Directional Bus Driver • 3232 – Address Multiplexer and Refresh Counter for 4K DRAMs • 3242 – Address Multiplexer and Refresh Counter for 16K (16 × 1024 B) DRAMs • 3245 – Quad Bipolar TTL-to-MOS Level Shifter and Driver for 4K • 3246 – Quad Bipolar ECL-to-MOS Level Shifter and Driver for 4K • 3404 – High-performance 6-bit Latch • 3408 – Hex Sense Amp and Latch for MOS Memories • 3505 – Next generation processor Bus width 2
n bits data/address (depending on number
n of slices used) ===The
16-bit processors: MCS-86 family=== ====
8086==== • Introduced June 8, 1978 • Clock rates: • 5 MHz, 0.33 MIPS • 8 MHz, 0.66 MIPS • 10 MHz, 0.75 MIPS • The memory is divided into odd and even banks. It accesses both banks concurrently to read 16 bits of data in one memory cycle • Data bus width: 16 bits, address bus: 20 bits, multiplexed • 29,000 transistors at 3 μm • Addressable memory: 1 megabyte (1024B) • Up to 10× the performance of 8080 • First used in the Compaq Deskpro IBM PC-compatible computers. Later used in portable computing, and in the
IBM PS/2 Model 25 and
Model 30. Also used in the
AT&T PC6300 / Olivetti M24, a popular IBM PC-compatible (predating the IBM PS/2 line) and the WANG PC. • Used
segment registers to access more than 64 KB of data at once. • The first x86 CPU • Later renamed the iAPX 86 ====
8088==== • Introduced June 1, 1979 • Clock rates: • 4.77 MHz, 0.33 MIPS • 8 MHz, 0.66 MIPS • First x86 chip to handle
32-bit data sets • Reworked and expanded memory protection support including
paged virtual memory and virtual-86 mode, features required at the time by
Xenix and
Unix. This memory capability spurred the development and availability of
OS/2 and is a fundamental requirement for modern operating systems like
Linux,
Windows, and
macOS • First used by Compaq in the
Deskpro 386. Used in desktop computing • Unlike the DX naming convention of the 486 chips, it had no math co-processor • Later renamed Intel386 DX ====
80386SX==== • Introduced June 16, 1988 • Clock rates: • 16 MHz, 2.5 MIPS • 20 MHz, 3.1 MIPS, introduced January 25, 1989 • 25 MHz, 3.9 MIPS, introduced January 25, 1989 • 33 MHz, 5.1 MIPS, introduced October 26, 1992 • 32-bit internal architecture • External data bus width: 16 bits • External address bus width: 24 bits • 275,000 transistors at 1 μm • Addressable memory 16 MB • Virtual memory 64 TB • 380, 1.60 GHz, with Execute Disable bit • 390, 1.70 GHz, with Execute Disable bit •
Yonah-1024
65 nm process technology • 64 KB L1 cache • 1 MB L2 cache (integrated) •
SSE3 SIMD instructions, 533 MHz front-side bus, execute-disable bit • No
SpeedStep technology, is not part of the '
Centrino' package • Variants • 410, 1.46 GHz • 420, 1.60 GHz, • 423, 1.06 GHz (ultra-low voltage) • 430, 1.73 GHz • 440, 1.86 GHz • 443, 1.20 GHz (ultra-low voltage) • 450, 2.00 GHz ====
Intel Core==== •
Yonah 0.065 μm (
65 nm) process technology • Introduced January 2006 • 533/667 MHz
front-side bus • 2 MB (Shared on Duo) L2 cache •
SSE3 SIMD instructions • 31W
TDP (T versions) • Family 6, Model 14 • Variants: • Intel Core Duo T2700 2.33 GHz • Intel Core Duo T2600 2.16 GHz • Intel Core Duo T2500 2 GHz • Intel Core Duo T2450 2 GHz • Intel Core Duo T2400 1.83 GHz • Intel Core Duo T2300 1.66 GHz • Intel Core Duo T2050 1.6 GHz • Intel Core Duo T2300e 1.66 GHz • Intel Core Duo T2080 1.73 GHz • Intel Core Duo L2500 1.83 GHz (low voltage, 15 W
TDP) • Intel Core Duo L2400 1.66 GHz (low voltage, 15 W TDP) • Intel Core Duo L2300 1.5 GHz (low voltage, 15 W TDP) • Intel Core Duo U2500 1.2 GHz (ultra-low voltage, 9 W TDP) • Intel Core Solo T1350 1.86 GHz (533 FSB) • Intel Core Solo T1300 1.66 GHz • Intel Core Solo T1200 1.5 GHz ====Dual-Core
Xeon LV==== •
Sossaman 0.065 μm (
65 nm) process technology • Introduced March 2006 • Based on
Yonah core, with
SSE3 SIMD instructions • 667 MHz
frontside bus • 2 MB shared L2 cache • Variants • 2.0 GHz ===32-bit processors:
NetBurst microarchitecture=== ====
Pentium 4==== • 0.18 μm process technology (1.40 and 1.50 GHz) • Introduced November 20, 2000 • L2 cache was 256 KB Advanced Transfer cache (integrated) • Processor package Style was PGA423, PGA478 • System bus clock rate 400 MHz •
SSE2 SIMD Extensions • 42 million transistors • Used in desktops and entry-level workstations • 0.18 μm process technology (1.7 GHz) • Introduced April 23, 2001 • See the 1.4 and 1.5 chips for details • 0.18 μm process technology (1.6 and 1.8 GHz) • Introduced July 2, 2001 • See 1.4 and 1.5 chips for details • Core voltage is 1.15 volts in Maximum Performance Mode; 1.05 volts in battery optimized mode • Power ) 1 MB L2 cache • 533 MHz system bus (2.4A and 2.8A only) • 800 MHz system bus (all other models) • 125 million transistors in 1 MB models • 169 million transistors in 2 MB models •
Hyper-Threading support is only available on CPUs using the 800 MHz system bus. • The processor's integer
instruction pipeline has been increased from 20 stages to 31 stages, which theoretically allows for even greater bandwidth • 7500 to 11,000 MIPS •
LGA 775 versions are in the 5xx series (32-bit) and 5
x1 series (with Intel 64) • The 6xx series has 2 MB L2 cache and
Intel 64 ===
64-bit processors:
IA-64=== • New instruction set, not at all related to x86 • Before the feature was eliminated (
Montecito, July 2006) IA-64 processors supported 32-bit x86 in hardware, but
slowly (see its 2001
market reception and 2006
architectural changes) ====
Itanium==== • Code name Merced • Family 7 • Released May 29, 2001 • 733 MHz and 800 MHz • 2 MB cache • All recalled and replaced by Itanium 2 ====
Itanium 2==== • Family 0x1F • Released July 2002 • 900 MHz – 1.6 GHz • McKinley 900 MHz 1.5 MB cache, Model 0x0 • McKinley 1 GHz, 3 MB cache, Model 0x0 • Deerfield 1 GHz, 1.5 MB cache, Model 0x1 • Madison 1.3 GHz, 3 MB cache, Model 0x1 • Madison 1.4 GHz, 4 MB cache, Model 0x1 • Madison 1.5 GHz, 6 MB cache, Model 0x1 • Madison 1.67 GHz, 9 MB cache, Model 0x1 • Hondo 1.4 GHz, 4 MB cache,
dual-core MCM, Model 0x1 ===
64-bit processors: Intel 64 – NetBurst microarchitecture=== • Intel Extended Memory 64 Technology • Mostly compatible with
AMD's
AMD64 architecture • Introduced Spring 2004, with the Pentium 4F (D0 and later P4 steppings)
Pentium 4F •
Prescott-2M built on 0.09 μm (
90 nm) process technology • 2.8–3.8 GHz (model numbers 6
x0) • Introduced February 20, 2005 • Same features as Prescott with the addition of: • 2 MB cache • Intel
64-bit • Enhanced Intel
SpeedStep Technology (EIST) •
Cedar Mill built on 0.065 μm (
65 nm) process technology • 3.0–3.6 GHz (model numbers 6
x1) • Introduced January 16, 2006 • Die shrink of Prescott-2M • Same features as Prescott-2M • Family 15 Model 4 ====
Pentium D==== •
Dual-core microprocessor • No Hyper-Threading • 800 (4×200) MHz
front-side bus •
LGA 775 (Socket T) •
Smithfield (Pentium D) –
90 nm process technology (2.66–3.2 GHz) • Introduced May 26, 2005 • 2.66–3.2 GHz (model numbers 805–840) • 230 million transistors • 1 MB × 2 (non-shared, 2 MB total) L2 cache • Cache coherency between cores requires communication over the FSB • Performance increase of 60% over similarly clocked Prescott • 2.66 GHz (533 MHz FSB) Pentium D 805 introduced December 2005 • Contains 2×
Prescott dies in one package • Family 15 Model 4 •
Presler (Pentium D) –
65 nm process technology (2.8–3.6 GHz) • Introduced January 16, 2006 • 2.8–3.6 GHz (model numbers 915–960) • 376 million transistors • 2× 2 MB (non-shared, 4 MB total) L2 cache • Contains 2×
Cedar Mill dies in one package • Variants • Pentium D 945 ====
Pentium Extreme Edition==== • Dual-core microprocessor • Enabled Hyper-Threading • 800 (4×200) MHz
front-side bus •
Smithfield (Pentium Extreme Edition) –
90 nm process technology (3.2 GHz) • Variants • Pentium 840 EE – 3.20 GHz (2 × 1 MB L2) •
Presler (Pentium Extreme Edition) –
65 nm process technology (3.46, 3.73) • 2 MB × 2 (non-shared, 4 MB total) L2 cache • Variants • Pentium 955 EE – 3.46 GHz, 1066 MHz
front-side bus • Pentium 965 EE – 3.73 GHz, 1066 MHz
front-side bus ====
Xeon (64-bit NetBurst)==== •
Nocona • Introduced 2004 •
Irwindale • Introduced 2004 •
Cranford • Introduced April 2005 • MP version of Nocona •
Potomac • Introduced April 2005 • Cranford with 8 MB of L3 cache •
Paxville DP (2.8 GHz) • Introduced October 10, 2005 • Dual-core version of Irwindale, with 4 MB of L2 cache (2 MB per core) • 2.8 GHz • 800 MT/s front-side bus •
Paxville MP – 90 nm process (2.67 – 3.0 GHz) • Introduced November 1, 2005 • Dual-core Xeon 7000 series • MP-capable version of Paxville DP • 2 MB of L2 cache (1 MB per core) or 4 MB of L2 (2 MB per core) • 667 MT/s FSB or 800 MT/s FSB •
Dempsey – 65 nm process (2.67–3.73 GHz) • Introduced May 23, 2006 • Dual-core Xeon 5000 series • MP version of Presler • 667 MT/s or 1066 MT/s FSB • 4 MB of L2 cache (2 MB per core) •
LGA 771 (Socket J). •
Tulsa – 65 nm process (2.5–3.4 GHz) • Introduced August 29, 2006 • Dual-core Xeon 7100-series • Improved version of Paxville MP • 667 MT/s or 800 MT/s FSB ===64-bit processors: Intel 64 –
Core microarchitecture===
Xeon (64-bit Core microarchitecture) •
Woodcrest –
65 nm process technology • Server and Workstation CPU (SMP support for dual CPU system) • Introduced June 26, 2006 •
Intel VT-x, multiple
OS support • EIST (Enhanced Intel
SpeedStep Technology) in 5140, 5148LV, 5150, 5160 •
Execute Disable Bit •
TXT, enhanced security hardware extensions •
SSSE3 SIMD instructions • iAMT2 (Intel Active Management Technology), remotely manage computers • Variants • Xeon 5160, 3.00 GHz (4 MB L2, 1333 MHz FSB, 80 W) • Xeon 5150, 2.66 GHz (4 MB L2, 1333 MHz FSB, 65 W) • Xeon 5140, 2.33 GHz (4 MB L2, 1333 MHz FSB, 65 W) • Xeon 5130, 2.00 GHz (4 MB L2, 1333 MHz FSB, 65 W) • Xeon 5120, 1.86 GHz (4 MB L2, 1066 MHz FSB, 65 W) • Xeon 5110, 1.60 GHz (4 MB L2, 1066 MHz FSB, 65 W) • Xeon 5148LV, 2.33 GHz (4 MB L2, 1333 MHz FSB, 40 W) (low voltage edition) •
Clovertown –
65 nm process technology • Server and Workstation CPU (SMP support for dual CPU system) • Introduced December 13, 2006 •
Quad-core •
Intel VT-x, multiple
OS support • EIST (Enhanced Intel
SpeedStep Technology) in E5365, L5335 •
Execute Disable Bit •
TXT, enhanced security hardware extensions •
SSSE3 SIMD instructions • iAMT2 (Intel Active Management Technology), remotely manage computers • Variants • Xeon X5355, 2.66 GHz (2×4 MB L2, 1333 MHz FSB, 105 W) • Xeon E5345, 2.33 GHz (2×4 MB L2, 1333 MHz FSB, 80 W) • Xeon E5335, 2.00 GHz (2×4 MB L2, 1333 MHz FSB, 80 W) • Xeon E5320, 1.86 GHz (2×4 MB L2, 1066 MHz FSB, 65 W) • Xeon E5310, 1.60 GHz (2×4 MB L2, 1066 MHz FSB, 65 W) • Xeon L5320, 1.86 GHz (2×4 MB L2, 1066 MHz FSB, 50 W) (low voltage edition) ====
Intel Core 2==== •
Conroe –
65 nm process technology • Desktop CPU (SMP support restricted to 2 CPUs) • Two cores on one die • Introduced July 27, 2006 •
SSSE3 SIMD instructions • 291 million transistors • 64 KB of L1 cache per core (32+32 KB 8-way) •
Intel VT-x, multiple
OS support •
TXT, enhanced security hardware extensions •
Execute Disable Bit • EIST (Enhanced Intel
SpeedStep Technology) • iAMT2 (Intel Active Management Technology), remotely manage computers •
Intel Management Engine introduced •
LGA 775 • Variants • Core 2 Duo E6850, 3.00 GHz (4 MB L2, 1333 MHz FSB) • Core 2 Duo E6800, 2.93 GHz (4 MB L2, 1066 MHz FSB) • Core 2 Duo E6750, 2.67 GHz (4 MB L2, 1333 MHz FSB, 65 W) • Core 2 Duo E6700, 2.67 GHz (4 MB L2, 1066 MHz FSB) • Core 2 Duo E6600, 2.40 GHz (4 MB L2, 1066 MHz FSB, 65 W) • Core 2 Duo E6550, 2.33 GHz (4 MB L2, 1333 MHz FSB) • Core 2 Duo E6420, 2.13 GHz (4 MB L2, 1066 MHz FSB) • Core 2 Duo E6400, 2.13 GHz (2 MB L2, 1066 MHz FSB) • Core 2 Duo E6320, 1.86 GHz (4 MB L2, 1066 MHz FSB) Family 6, Model 15, Stepping 6 • Core 2 Duo E6300, 1.86 GHz (2 MB L2, 1066 MHz FSB) •
Conroe XE –
65 nm process technology • Desktop Extreme Edition CPU (SMP support restricted to 2 CPUs) • Introduced July 27, 2006 • Same features as
Conroe •
LGA 775 • Variants • Core 2 Extreme X6800 – 2.93 GHz (4 MB L2, 1066 MHz FSB) •
Allendale (Intel Core 2) –
65 nm process technology • Desktop CPU (SMP support restricted to 2 CPUs) • Two CPUs on one die • Introduced January 21, 2007 •
SSSE3 SIMD instructions • 167 million transistors •
TXT, enhanced security hardware extensions •
Execute Disable Bit • EIST (Enhanced Intel
SpeedStep Technology) • iAMT2 (Intel Active Management Technology), remotely manage computers •
LGA 775 • Variants • Core 2 Duo E4700, 2.60 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo E4600, 2.40 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo E4500, 2.20 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo E4400, 2.00 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo E4300, 1.80 GHz (2 MB L2, 800 MHz FSB) Family 6, Model 15, Stepping 2 •
Merom –
65 nm process technology • Mobile CPU (SMP support restricted to 2 CPUs) • Introduced July 27, 2006 • Family 6, Model 15 • Same features as
Conroe •
Socket M /
Socket P / 479-ball Micro-FCBGA • Variants • Core 2 Extreme X7900 2.80 GHz (4 MB L2, 800 MHz FSB) • Core 2 Extreme X7800 2.60 GHz (4 MB L2, 800 MHz FSB) • Core 2 Duo T7800, 2.60 GHz (4 MB L2, 800 MHz FSB) (
Santa Rosa platform) • Core 2 Duo T7700, 2.40 GHz (4 MB L2, 800 MHz FSB) • Core 2 Duo T7600, 2.33 GHz (4 MB L2, 667 MHz FSB) • Core 2 Duo T7500, 2.20 GHz (4 MB L2, 800 MHz FSB) • Core 2 Duo T7400, 2.16 GHz (4 MB L2, 667 MHz FSB) • Core 2 Duo T7300, 2.00 GHz (4 MB L2, 800 MHz FSB) • Core 2 Duo T7250, 2.00 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo T7200, 2.00 GHz (4 MB L2, 667 MHz FSB) • Core 2 Duo T7100, 1.80 GHz (2 MB L2, 800 MHz FSB) • Core 2 Duo T5600, 1.83 GHz (2 MB L2, 667 MHz FSB) Family 6, Model 15, Stepping 6 • Core 2 Duo T5550, 1.83 GHz (2 MB L2, 667 MHz FSB, no VT) • Core 2 Duo T5500, 1.66 GHz (2 MB L2, 667 MHz FSB, no VT) • Core 2 Duo T5470, 1.60 GHz (2 MB L2, 800 MHz FSB, no VT) Family 6, Model 15, Stepping 13 • Core 2 Duo T5450, 1.66 GHz (2 MB L2, 667 MHz FSB, no VT) • Core 2 Duo T5300, 1.73 GHz (2 MB L2, 533 MHz FSB, no VT) • Core 2 Duo T5270, 1.40 GHz (2 MB L2, 800 MHz FSB, no VT) • Core 2 Duo T5250, 1.50 GHz (2 MB L2, 667 MHz FSB, no VT) • Core 2 Duo T5200, 1.60 GHz (2 MB L2, 533 MHz FSB, no VT) • Core 2 Duo L7700, 1.80 GHz (4 MB L2, 800 MHz FSB) (low voltage) Family 6, Model 15, Stepping 11 • Core 2 Duo L7500, 1.60 GHz (4 MB L2, 800 MHz FSB) (low voltage) • Core 2 Duo L7400, 1.50 GHz (4 MB L2, 667 MHz FSB) (low voltage) • Core 2 Duo L7300, 1.40 GHz (4 MB L2, 800 MHz FSB) (low voltage) • Core 2 Duo L7200, 1.33 GHz (4 MB L2, 667 MHz FSB) (low voltage) • Core 2 Duo U7700, 1.33 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage) • Core 2 Duo U7600, 1.20 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage) • Core 2 Duo U7500, 1.06 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage) • Core 2 Duo U7100, 1.20 GHz (4 MB L2, 800 MHz FSB) (ultra low voltage) Family 6, Model 15, Stepping 11 • Core 2 Solo U2100, 1.06 GHz (1 MB L2, 533 MHz FSB) (ultra low voltage) • Core 2 Solo U2200, 1.20 GHz (1 MB L2, 533 MHz FSB) (ultra low voltage) •
Kentsfield –
65 nm process technology • Two dual-core CPU dies in one package • Desktop CPU quad-core (SMP support restricted to 4 CPUs) • Introduced December 13, 2006 • Same features as
Conroe but with 4 CPU cores • 586 million transistors •
LGA 775 • Family 6, Model 15, Stepping 11 • Variants • Core 2 Extreme QX6850, 3 GHz (2×4 MB L2 cache, 1333 MHz FSB) • Core 2 Extreme QX6800, 2.93 GHz (2×4 MB L2 cache, 1066 MHz FSB) (April 9, 2007) • Core 2 Extreme QX6700, 2.66 GHz (2×4 MB L2 cache, 1066 MHz FSB) (November 14, 2006) • Core 2 Quad Q6700, 2.66 GHz (2×4 MB L2 cache, 1066 MHz FSB) (July 22, 2007) • Core 2 Quad Q6600, 2.40 GHz (2×4 MB L2 cache, 1066 MHz FSB) (January 7, 2007) •
Wolfdale –
45 nm process technology • Die shrink of
Conroe • Same features as
Conroe with the addition of: • 50% more cache, 6 MB as opposed to 4 MB • Intel Trusted Execution Technology •
SSE4 SIMD instructions • 410 million transistors • Variants • Core 2 Duo E8600, 3.33 GHz (6 MB L2, 1333 MHz FSB) • Core 2 Duo E8500, 3.16 GHz (6 MB L2, 1333 MHz FSB) • Core 2 Duo E8435, 3.07 GHz (6 MB L2, 1066 MHz FSB) • Core 2 Duo E8400, 3.00 GHz (6 MB L2, 1333 MHz FSB) • Core 2 Duo E8335, 2.93 GHz (6 MB L2, 1066 MHz FSB) • Core 2 Duo E8300, 2.83 GHz (6 MB L2, 1333 MHz FSB) • Core 2 Duo E8235, 2.80 GHz (6 MB L2, 1066 MHz FSB) • Core 2 Duo E8200, 2.66 GHz (6 MB L2, 1333 MHz FSB) • Core 2 Duo E8135, 2.66 GHz (6 MB L2, 1066 MHz FSB) • Core 2 Duo E8190, 2.66 GHz (6 MB L2, 1333 MHz FSB, no TXT, no VT) •
Wolfdale-3M (Intel Core 2) –
45 nm process technology • Intel Trusted Execution Technology • Variants • Core 2 Duo E7600, 3.06 GHz (3 MB L2, 1066 MHz FSB) • Core 2 Duo E7500, 2.93 GHz (3 MB L2, 1066 MHz FSB) • Core 2 Duo E7400, 2.80 GHz (3 MB L2, 1066 MHz FSB) • Core 2 Duo E7300, 2.66 GHz (3 MB L2, 1066 MHz FSB) • Core 2 Duo E7200, 2.53 GHz (3 MB L2, 1066 MHz FSB) •
Yorkfield,
45 nm process technology • Quad-core CPU • Die shrink of
Kentsfield • Contains 2×
Wolfdale dual-core dies in one package • Same features as
Wolfdale • 820 million transistors • Variants • Core 2 Extreme QX9770, 3.20 GHz (2×6 MB L2, 1600 MHz FSB) • Core 2 Extreme QX9650, 3.00 GHz (2×6 MB L2, 1333 MHz FSB) • Core 2 Quad Q9705, 3.16 GHz (2×3 MB L2, 1333 MHz FSB) • Core 2 Quad Q9700, 3.16 GHz (2×3 MB L2, 1333 MHz FSB) • Core 2 Quad Q9650, 3 GHz (2×6 MB L2, 1333 MHz FSB) • Core 2 Quad Q9550, 2.83 GHz (2×6 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q9550s, 2.83 GHz (2×6 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q9450, 2.66 GHz (2×6 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q9505, 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q9505s, 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q9500, 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 95 W TDP, no TXT) • Core 2 Quad Q9400, 2.66 GHz (2×3 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q9400s, 2.66 GHz (2×3 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q9300, 2.50 GHz (2×3 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q8400, 2.66 GHz (2×2 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q8400s, 2.66 GHz (2×2 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q8300, 2.50 GHz (2×2 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q8300s, 2.50 GHz (2×2 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q8200, 2.33 GHz (2×2 MB L2, 1333 MHz FSB, 95 W TDP) • Core 2 Quad Q8200s, 2.33 GHz (2×2 MB L2, 1333 MHz FSB, 65 W TDP) • Core 2 Quad Q7600, 2.70 GHz (2×1 MB L2, 800 MHz FSB, no SSE4) (no Q7600 listed here) • Intel Core2 Quad Mobile processor family –
45 nm process technology • Quad-core CPU • Variants • Core 2 Quad Q9100, 2.26 GHz (2×6 MB L2, 1066 MHz FSB, 45 W TDP) • Core 2 Quad Q9000, 2.00 GHz (2×3 MB L2, 1066 MHz FSB, 45 W TDP) ====
Pentium Dual-Core==== •
Allendale (Pentium Dual-Core) –
65 nm process technology • Desktop CPU (SMP support restricted to 2 CPUs) • Two cores on one die • Introduced January 21, 2007 •
SSSE3 SIMD instructions • 167 million transistors •
TXT, enhanced security hardware extensions •
Execute Disable Bit • EIST (Enhanced Intel
SpeedStep Technology) • Variants • Intel Pentium E2220, 2.40 GHz (1 MB L2, 800 MHz FSB) • Intel Pentium E2200, 2.20 GHz (1 MB L2, 800 MHz FSB) • Intel Pentium E2180, 2.00 GHz (1 MB L2, 800 MHz FSB) • Intel Pentium E2160, 1.80 GHz (1 MB L2, 800 MHz FSB) • Intel Pentium E2140, 1.60 GHz (1 MB L2, 800 MHz FSB) •
Wolfdale-3M (Pentium Dual-Core) –
45 nm process technology • Intel Pentium E6800, 3.33 GHz (2 MB L2,1066 MHz FSB) • Intel Pentium E6700, 3.20 GHz (2 MB L2,1066 MHz FSB) • Intel Pentium E6600, 3.06 GHz (2 MB L2,1066 MHz FSB) • Intel Pentium E6500, 2.93 GHz (2 MB L2,1066 MHz FSB) • Intel Pentium E6300, 2.80 GHz (2 MB L2,1066 MHz FSB) • Intel Pentium E5800, 3.20 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E5700, 3.00 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E5500, 2.80 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E5400, 2.70 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E5300, 2.60 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E5200, 2.50 GHz (2 MB L2, 800 MHz FSB) • Intel Pentium E2210, 2.20 GHz (1 MB L2, 800 MHz FSB) ====
Celeron (64-bit Core microarchitecture)==== •
Allendale (Celeron, 64-bit Core microarchitecture) –
65 nm process technology • Variants • Intel Celeron E1600, 2.40 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron E1500, 2.20 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron E1400, 2.00 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron E1200, 1.60 GHz (512 KB L2, 800 MHz FSB) •
Wolfdale-3M (Celeron, 64-bit Core microarchitecture) –
45 nm process technology • Variants • Intel Celeron E3500, 2.70 GHz (1 MB L2, 800 MHz FSB) • Intel Celeron E3400, 2.60 GHz (1 MB L2, 800 MHz FSB) • Intel Celeron E3300, 2.50 GHz (1 MB L2, 800 MHz FSB) • Intel Celeron E3200, 2.40 GHz (1 MB L2, 800 MHz FSB) •
Conroe-L (Celeron, 64-bit Core microarchitecture) –
65 nm process technology • Variants • Intel Celeron 450, 2.20 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron 440, 2.00 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron 430, 1.80 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron 420, 1.60 GHz (512 KB L2, 800 MHz FSB) • Intel Celeron 220, 1.20 GHz (512 KB L2, 533 MHz FSB) •
Conroe-CL (Celeron, 64-bit Core microarchitecture) –
65 nm process technology • LGA 771 package • Variants • Intel Celeron 445, 1.87 GHz (512 KB L2, 1066 MHz FSB) ====
Celeron M (64-bit Core microarchitecture)==== •
Merom-L 65 nm process technology • 64 KB L1 cache • 1 MB L2 cache (integrated) •
SSE3 SIMD instructions, 533 MHz/667 MHz front-side bus, execute-disable bit, 64-bit • No
SpeedStep technology, is not part of the '
Centrino' package • Variants • 520, 1.60 GHz • 530, 1.73 GHz • 540, 1.86 GHz • 550, 2.00 GHz • 560, 2.13 GHz • 570, 2.26 GHz • 667 MHz FSB • 575, 2.00 GHz • 585, 2.16 GHz ===64-bit processors: Intel 64 –
Nehalem microarchitecture=== ====
Intel Pentium (Nehalem)==== •
Clarkdale (Pentium, Nehalem microarchitecture) –
32 nm process technology (manufacturing 7 Jan 2010) • 2 physical cores/2 threads • 32+32 KB L1 cache • 256 KB L2 cache • 3 MB L3 cache • Introduced January 2010 • Socket 1156 LGA • 2-channel DDR3 • Integrated HD GPU • Variants • G6950, 2.8 GHz (no
Hyper-Threading) • G6960, 2.933 GHz (no Hyper-Threading) ====
Core i3 (1st generation)==== •
Clarkdale (Core i3 1st generation) –
32 nm process technology • 2 physical cores/4 threads • 32+32 KB L1 cache • 256 KB L2 cache • 4 MB L3 cache • Introduced on January 7, 2010 • Socket 1156 LGA • 2-channel DDR3 • Integrated HD GPU • Variants • 530, 2.93 GHz Hyper-Threading • 540, 3.06 GHz Hyper-Threading • 550, 3.2 GHz Hyper-Threading • 560, 3.33 GHz Hyper-Threading ====
Core i5 (1st generation)==== •
Lynnfield (Core i5 1st generation) –
45 nm process technology • 4 physical cores/4 threads • 32+32 KB L1 cache • 256 KB L2 cache • 8 MB L3 cache • Introduced September 8, 2009 • Family 6 Model E (Ext. Model 1E) •
Socket 1156 LGA • 2-channel DDR3 • Variants • 750S, 2.40 GHz/3.20 GHz Turbo Boost • 750, 2.66 GHz/3.20 GHz Turbo Boost • 760, 2.80 GHz/3.33 GHz Turbo Boost •
Clarkdale (Core i5 1st generation) –
32 nm process technology • 2 physical cores/4 threads • 32+32 KB L1 cache • 256 KB L2 cache • 4 MB L3 cache • Introduced January, 2010 •
Socket 1156 LGA • 2-channel DDR3 • Integrated HD GPU • AES Support • Variants • 650/655K, 3.2 GHz Hyper-Threading Turbo Boost • 660/661, 3.33 GHz Hyper-Threading Turbo Boost • 670, 3.46 GHz Hyper-Threading Turbo Boost • 680, 3.60 GHz Hyper-Threading Turbo Boost ====
Core i7 (1st generation)==== •
Bloomfield (Core i7 1st generation) –
45 nm process technology • 4 physical cores/8 threads • 256 KB L2 cache • 8 MB L3 cache •
Front-side bus replaced with
QuickPath up to 6.4 GT/s •
Hyper-Threading is again included. This had previously been removed at the introduction of
Core line • 781 million
transistors • Intel Turbo Boost Technology • TDP 130 W • Introduced November 17, 2008 • Socket 1366 LGA • 3-channel DDR3 • Variants • 975 (extreme edition), 3.33 GHz/3.60 GHz Turbo Boost • 965 (extreme edition), 3.20 GHz/3.46 GHz Turbo Boost • 960, 3.20 GHz/3.46 GHz Turbo Boost • 950, 3.06 GHz/3.33 GHz Turbo Boost • 940, 2.93 GHz/3.20 GHz Turbo Boost • 930, 2.80 GHz/3.06 GHz Turbo Boost • 920, 2.66 GHz/2.93 GHz Turbo Boost •
Lynnfield (Core i7 1st generation) –
45 nm process technology • 4 physical cores/8 threads • 32+32 KB L1 cache • 256 KB L2 cache • 8 MB L3 cache • No
QuickPath, instead compatible with slower
DMI interface •
Hyper-Threading is included • Introduced September 8, 2009 • Socket 1156 LGA • 2-channel DDR3 • Variants • 880, 3.06 GHz/3.73 GHz Turbo Boost (TDP 95 W) • 870/875K, 2.93 GHz/3.60 GHz Turbo Boost (TDP 95 W) • 870S, 2.67 GHz/3.60 GHz Turbo Boost (TDP 82 W) • 860, 2.80 GHz/3.46 GHz Turbo Boost (TDP 95 W) • 860S, 2.53 GHz/3.46 GHz Turbo Boost (TDP 82 W)
Westmere •
Gulftown,
32 nm process technology • 6 physical cores • 256 KB L2 cache • 12 MB L3 cache •
Front-side bus replaced with
QuickPath up to 6.4 GT/s •
Hyper-Threading is included • Intel Turbo Boost Technology •
Socket 1366 LGA • TDP 130 W • Introduced 16 March 2010 • Variants • 990X Extreme Edition, 3.46 GHz/3.73 GHz Turbo Boost • 980X Extreme Edition, 3.33 GHz/3.60 GHz Turbo Boost • 970, 3.20 GHz/3.46 GHz Turbo Boost •
Clarksfield – Intel Core i7 Mobile processor family –
45 nm process technology • 4 physical cores •
Hyper-Threading is included • Intel Turbo Boost Technology • Variants • 940XM Extreme Edition, 2.13 GHz/3.33 GHz Turbo Boost (8 MB L3, TDP 55 W) • 920XM Extreme Edition, 2.00 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 55 W) • 840QM, 1.86 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 45 W) • 820QM, 1.73 GHz/3.06 GHz Turbo Boost (8 MB L3, TDP 45 W) • 740QM, 1.73 GHz/2.93 GHz Turbo Boost (6 MB L3, TDP 45 W) • 720QM, 1.60 GHz/2.80 GHz Turbo Boost (6 MB L3, TDP 45 W) ====
Xeon (Nehalem microarchitecture)==== •
Gainestown –
45 nm process technology • Same processor dies as Bloomfield • 256 KB L2 cache • 8 MB L3 cache, 4 MB may be disabled •
QuickPath up to 6.4 GT/s •
Hyper-Threading is included in some models • 781 million
transistors • Introduced March 29, 2009 • Variants • W5590, X5570, X5560, X5550, E5540, E5530, L5530, E5520, L5520, L5518, 4 cores, 8 MB L3 cache, HT • E5506, L5506, E5504, 4 cores, 4 MB L3 cache, no HT • L5508, E5502, E5502, 2 cores, 4 MB L3 cache, no HT ===64-bit processors: Intel 64 –
Sandy Bridge /
Ivy Bridge microarchitecture=== ====
Celeron (Sandy Bridge/Ivy Bridge microarchitecture)==== •
Sandy Bridge (Celeron-branded) –
32 nm process technology • 2 physical cores/2 threads (500 series), 1 physical core/1 thread (model G440) or 1 physical core/2 threads (models G460 & G465) • 2 MB L3 cache (500 series), 1 MB (model G440) or 1.5 MB (models G460 & G465) • Introduced 3rd quarter, 2011 •
Socket 1155 LGA • 2-channel DDR3-1066 • 400 series has max TDP of 35 W • 500-series variants ending in 'T' have a peak TDP of 35 W; others, 65 W • Integrated GPU • All variants have peak GPU turbo frequencies of 1 GHz • Variants in the 400 series have GPUs running at a base frequency of 650 MHz • Variants in the 500 series ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz • All variants have 6 GPU execution units • Variants • G440, 1.6 GHz • G460, 1.8 GHz • G465, 1.9 GHz • G470, 2.0 GHz • G530T, 2.0 GHz • G540T, 2.1 GHz • G550T, 2.2 GHz • G530, 2.4 GHz • G540, 2.5 GHz • G550, 2.6 GHz • G555, 2.7 GHz ====
Pentium (Sandy Bridge/Ivy Bridge microarchitecture)==== •
Sandy Bridge (Pentium-branded) –
32 nm process technology • 2 physical cores/2 threads • 3 MB L3 cache • 624 million transistors • Introduced May, 2011 •
Socket 1155 LGA • 2-channel DDR3-1333 (800 series) or DDR3-1066 (600 series) • Variants ending in 'T' have a peak TDP of 35 W, others 65 W • Integrated GPU (
HD 2000) • All variants have peak GPU turbo frequencies of 1.1 GHz • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz • All variants have 6 GPU execution units • Variants • G620T, 2.2 GHz • G630T, 2.3 GHz • G640T, 2.4 GHz • G645T, 2.5 GHz • G860T, 2.6 GHz • G620, 2.6 GHz • G622, 2.6 GHz • G630, 2.7 GHz • G632, 2.7 GHz • G640, 2.8 GHz • G840, 2.8 GHz • G645, 2.9 GHz • G850, 2.9 GHz • G860, 3.0 GHz • G870, 3.1 GHz •
Ivy Bridge (Pentium-branded) –
22 nm tri-gate transistor process technology • 2 physical cores/2 threads • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 3 MB L3 cache • Introduced September, 2012 •
Socket 1155 LGA • 2-channel DDR3-1333 for G2000 series • 2-channel DDR3-1600 for G2100 series • All variants have GPU base frequencies of 650 MHz and peak GPU turbo frequencies of 1.05 GHz • Variants ending in 'T' have a peak TDP of 35 W; others, TDP of 55 W • Variants • G2020T, 2.5 GHz • G2030T, 2.6 GHz • G2100T, 2.6 GHz • G2120T, 2.7 GHz • G2010, 2.8 GHz • G2020, 2.9 GHz • G2030, 3.0 GHz • G2120, 3.1 GHz • G2130, 3.2 GHz • G2140, 3.3 GHz ====
Core i3 (2nd and 3rd generation)==== •
Sandy Bridge (Core i3 2nd generation) –
32 nm process technology • 2 physical cores/4 threads • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 3 MB L3 cache • 624 million transistors • Introduced January, 2011 •
Socket 1155 LGA • 2-channel DDR3-1333 • Variants ending in 'T' have a peak TDP of 35 W, others 65 W • Integrated GPU • All variants have peak GPU turbo frequencies of 1.1 GHz • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz • Variants ending in '5' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units) • Variants • i3-2100T, 2.5 GHz • i3-2120T, 2.6 GHz • i3-2100, 3.1 GHz • i3-2102, 3.1 GHz • i3-2105, 3.1 GHz • i3-2120, 3.3 GHz • i3-2125, 3.3 GHz • i3-2130, 3.4 GHz •
Ivy Bridge (Core i3 3rd generation) –
22 nm tri-gate transistor process technology • 2 physical cores/4 threads • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 3 MB L3 cache • Introduced September, 2012 •
Socket 1155 LGA • 2-channel DDR3-1600 • Variants ending in '5' have Intel HD Graphics 4000; others have Intel HD Graphics 2500 • All variants have GPU base frequencies of 650 MHz and peak GPU turbo frequencies of 1.05 GHz • TDP 55 W • Variants • i3-3220T, 2.8 GHz • i3-3240T, 2.9 GHz • i3-3210, 3.2 GHz • i3-3220, 3.3 GHz • i3-3225, 3.3 GHz • i3-3240, 3.4 GHz • i3-3250, 3.5 GHz ====
Core i5 (2nd and 3rd generation)==== •
Sandy Bridge (Core i5 2nd generation) –
32 nm process technology • 4 physical cores/4 threads (except for i5-2390T which has 2 physical cores/4 threads) • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 6 MB L3 cache (except for i5-2390T which has 3 MB) • 995 million transistors • Introduced January, 2011 •
Socket 1155 LGA • 2-channel DDR3-1333 • Variants ending in 'S' have a peak TDP of 65 W; others, 95 W except where noted • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked • Integrated GPU • i5-2500T has a peak GPU turbo frequency of 1.25 GHz, others 1.1 GHz • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz • Variants ending in '5' or 'K' have Intel HD Graphics 3000 (12 execution units), except i5-2550K which has no GPU; others have Intel HD Graphics 2000 (6 execution units) • Variants ending in 'P' and the i5-2550K have no GPU • Variants • i5-2390T, 2.7 GHz/3.5 GHz Turbo Boost (35 W max. TDP) • i5-2500T, 2.3 GHz/3.3 GHz Turbo Boost (45 W max. TDP) • i5-2400S, 2.5 GHz/3.3 GHz Turbo Boost • i5-2405S, 2.5 GHz/3.3 GHz Turbo Boost • i5-2500S, 2.7 GHz/3.7 GHz Turbo Boost • i5-2300, 2.8 GHz/3.1 GHz Turbo Boost • i5-2310, 2.9 GHz/3.2 GHz Turbo Boost • i5-2320, 3.0 GHz/3.3 GHz Turbo Boost • i5-2380P, 3.1 GHz/3.4 GHz Turbo Boost • i5-2400, 3.1 GHz/3.4 GHz Turbo Boost • i5-2450P, 3.2 GHz/3.5 GHz Turbo Boost • i5-2500, 3.3 GHz/3.7 GHz Turbo Boost • i5-2500K, 3.3 GHz/3.7 GHz Turbo Boost • i5-2550K, 3.4 GHz/3.8 GHz Turbo Boost •
Ivy Bridge (Core i5 3rd generation) –
22 nm Tri-gate transistor process technology • 4 physical cores/4 threads (except for i5-3470T which has 2 physical cores/4 threads) • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 6 MB L3 cache (except for i5-3470T which has 3 MB) • Introduced April, 2012 •
Socket 1155 LGA • 2-channel DDR3-1600 • Variants ending in 'S' have a peak TDP of 65 W, Variants ending in 'T' have a peak TDP of 35 or 45 W (see variants); others, 77 W except where noted • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked • Variants ending in 'P' have no integrated GPU; others have Intel HD Graphics 2500 or Intel HD Graphics 4000 (i5-3475S and i5-3570K only) • Variants • i5-3470T, 2.9 GHz/3.6 GHz max Turbo Boost (35 W TDP) • i5-3570T, 2.3 GHz/3.3 GHz max Turbo Boost (45 W TDP) • i5-3330S, 2.7 GHz/3.2 GHz max Turbo Boost • i5-3450S, 2.8 GHz/3.5 GHz max Turbo Boost • i5-3470S, 2.9 GHz/3.6 GHz max Turbo Boost • i5-3475S, 2.9 GHz/3.6 GHz max Turbo Boost • i5-3550S, 3.0 GHz/3.7 GHz max Turbo Boost • i5-3570S, 3.1 GHz/3.8 GHz max Turbo Boost • i5-3330, 3.0 GHz/3.2 GHz max Turbo Boost • i5-3350P, 3.1 GHz/3.3 GHz max Turbo Boost (69 W TDP) • i5-3450, 3.1 GHz/3.5 GHz max Turbo Boost • i5-3470, 3.2 GHz/3.6 GHz max Turbo Boost • i5-3550, 3.3 GHz/3.7 GHz max Turbo Boost • i5-3570, 3.4 GHz/3.8 GHz max Turbo Boost • i5-3570K, 3.4 GHz/3.8 GHz max Turbo Boost ====
Core i7 (2nd and 3rd generation)==== •
Sandy Bridge (Core i7 2nd generation) –
32 nm process technology • 4 physical cores/8 threads • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 8 MB L3 cache • 995 million transistors • Introduced January, 2011 •
Socket 1155 LGA • 2-channel DDR3-1333 • Variants ending in 'S' have a peak TDP of 65 W, others – 95 W • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked • Integrated GPU • All variants have base GPU frequencies of 850 MHz and peak GPU turbo frequencies of 1.35 GHz • Variants ending in 'K' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units) • Variants • i7-2600S, 2.8 GHz/3.8 GHz Turbo Boost • i7-2600, 3.4 GHz/3.8 GHz Turbo Boost • i7-2600K, 3.4 GHz/3.8 GHz Turbo Boost • i7-2700K, 3.5 GHz/3.9 GHz Turbo Boost •
Sandy Bridge-E (Core i7 3rd generation X-Series) –
32 nm process technology • Up to 6 physical cores/12 threads depending on model number • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • Up to 20 MB L3 cache depending on model number • 2.27 billion transistors • Introduced November, 2011 •
Socket 2011 LGA • 4-channel DDR3-1600 • All variants have a peak TDP of 130 W • No integrated GPU • Variants (all marketed under "Intel Core X-series processors") • i7-3820, 3.6 GHz/3.8 GHz Turbo Boost, 4 cores, 10 MB L3 cache • i7-3930K, 3.2 GHz/3.8 GHz Turbo Boost, 6 cores, 12 MB L3 cache • i7-3960X, 3.3 GHz/3.9 GHz Turbo Boost, 6 cores, 15 MB L3 cache • i7-3970X, 3.5 GHz/4.0 GHz Turbo Boost, 6 cores, 15 MB L3 cache •
Ivy Bridge (Core i7 3rd generation) –
22 nm Tri-gate transistor process technology • 4 physical cores/8 threads • 32+32 KB (per core) L1 cache • 256 KB (per core) L2 cache • 8 MB L3 cache • Introduced April, 2012 •
Socket 1155 LGA • 2-channel DDR3-1600 • Variants ending in 'S' have a peak TDP of 65 W, variants ending in 'T' have a peak TDP of 45 W, others – 77 W • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked • Integrated GPU Intel HD Graphics 4000 • Variants • i7-3770T – 2.5 GHz/3.7 GHz Turbo Boost • i7-3770S – 3.1 GHz/3.9 GHz Turbo Boost • i7-3770 – 3.4 GHz/3.9 GHz Turbo Boost • i7-3770K – 3.5 GHz/3.9 GHz Turbo Boost ===64-bit processors: Intel 64 –
Haswell microarchitecture=== ====
Core i3 (4th generation)==== •
Haswell (Core i3 4th generation) –
22nm process technology • 2 physical cores/4 threads • 4 MB L3 cache • Introduced Q2'13 •
Socket 1150 LGA • 2-channel DDR3L-1333/1600 • Integrated GPU • Variants • i3-4370 – 3.8 GHz ====
Core i5 (4th generation)==== •
Haswell (Core i5 4th generation) –
22nm process technology • 4 physical cores/4 threads • 4 MB L3 cache • Introduced Q2'13 •
Socket 1150 LGA • 2-channel DDR3L-1333/1600 • Integrated GPU • Variants • i5-4460 – 3.2 GHz/3.40 GHz Turbo Boost • i5-4590 – 3.7 GHz/3.70 GHz Turbo Boost • i5-4690 – 3.5 GHz/3.90 GHz Turbo Boost ===64-bit processors: Intel 64 –
Broadwell microarchitecture=== ====
Core i3 (5th generation)==== •
Broadwell (Core i3 5th generation) –
14nm process technology ====
Core i5 (5th generation)==== •
Broadwell (Core i5 5th generation) –
14nm process technology • 4 physical cores/4 threads • 4 MB L3 cache • Introduced Q2'15 •
Socket 1150 LGA • 2-channel DDR3L-1333/1600 • Integrated GPU • Variants • i5-5575R – 2.80 GHz/3.30 GHz Turbo Boost • i5-5675C – 3.10 GHz/3.60 GHz Turbo Boost • i5-5675R – 3.10 GHz/3.60 GHz Turbo Boost ====
Core i7 (5th generation, Including Core-X Series)==== •
Broadwell (Core i7 5th generation) –
14nm process technology • 4 physical cores/8 threads • 6 MB L3 cache • Introduced Q2'15 •
Socket 1150 LGA • 2-channel DDR3L-1333/1600 • Integrated GPU • Variants • i7-5775C – 3.30 GHz/3.70 GHz Turbo Boost • i7-5775R – 3.30 GHz/3.80 GHz Turbo Boost •
Broadwell-E –
14nm process technology • 6–10 physical cores/12–20 threads • 15–25 MB L3 cache • Introduced Q2'16 •
Socket 2011-v3 LGA • 4-channel DDR4-2133/2400 • No Integrated GPU • Variants (all marketed under "Intel Core X-series processors") • Server and workstation CPUs • single-CPU: Pentium D15nn, Xeon D-15nn, Xeon E3-12nn v4, Xeon E5-16nn v4 • dual-CPU: Xeon E5-26nn v4 • quad-CPU: Xeon E5-46nn v4, Xeon E7-48nn v4 • octo-CPU: Xeon E7-88nn v4 • Embedded CPUs • Core i7-57nnEQ, Core i7-58nnEQ • Mobile CPUs • Celeron 32nnU, Celeron 37nnU • Pentium 38nnU • Core M-5Ynn • Core i3-50nnU • Core i5-5nnnU • Core i7-55nnU, Core i7-56nnU, Core i7-57nnHQ, Core i7-59nnHQ Note: this list does not say that all processors that match these patterns are Broadwell-based or fit into this scheme. The model numbers may have suffixes that are not shown here. ===
64-bit processors: Intel 64 –
Skylake microarchitecture=== ====
Core i3 (6th generation)==== •
Skylake (Core i3 6th generation) –
14 nm process technology • 2 physical cores/4 threads • 3–4 MB L3 cache • Introduced Q3'15 •
Socket 1151 LGA • 2-channel DDR3L-1333/1600, DDR4-1866/2133 • Integrated GPU Intel HD Graphics 530 (only i3-6098P have HD Graphics 510) • Variants • i3-6098P – 3.60 GHz • i3-6100T – 3.20 GHz • i3-6100 – 3.70 GHz • i3-6300T – 3.30 GHz • i3-6300 – 3.80 GHz • i3-6320 – 3.90 GHz ====
Core i5 (6th generation)==== •
Skylake (Core i5 6th generation) –
14nm process technology • 4 physical cores/4 threads • 6 MB L3 cache • Introduced Q3'15 •
Socket 1151 LGA • 2-channel DDR3L-1333/1600, DDR4-1866/2133 • Integrated GPU Intel HD Graphics 530 • Variants • i5-6300HQ – 2.30/3.20 GHz Turbo Boost • i5-6400T – 2.20 GHz/2.80 GHz Turbo Boost • i5-6400 – 2.70 GHz/3.30 GHz Turbo Boost • i5-6440hq • i5-6500T – 2.50 GHz/3.10 GHz Turbo Boost • i5-6500 – 3.20 GHz/3.60 GHz Turbo Boost • i5-6600T – 2.70 GHz/3.50 GHz Turbo Boost • i5-6600 – 3.30 GHz/3.90 GHz Turbo Boost • i5-6600K – 3.50 GHz/3.90 GHz Turbo Boost ====
Core i7 (6th generation)==== •
Skylake (Core i7 6th generation) –
14nm process technology • 4 physical cores/8 threads • 8 MB L3 cache • Introduced Q3'15 •
Socket 1151 LGA • 2-channel DDR3L-1333/1600, DDR4-1866/2133 • Integrated GPU Intel HD Graphics 530 • Variants • i7-6700T – 2.80 GHz/3.60 GHz Turbo Boost • i7-6700 – 3.40 GHz/4.00 GHz Turbo Boost • i7-6700K – 4.00 GHz/4.20 GHz Turbo Boost
Other Skylake processors Many Skylake-based processors are not yet listed in this section: mobile i3/i5/i7 processors (U, H, and M suffixes), embedded i3/i5/i7 processors (E suffix), certain i7-67nn/i7-68nn/i7-69nn. Skylake-based "Core X-series" processors (certain i7-78nn and i9-79nn models) can be found under current models. ===64-bit processors: Intel 64 (7th generation) –
Kaby Lake microarchitecture=== ===64-bit processors: Intel 64 (8th and 9th generation) –
Coffee Lake microarchitecture=== ===64-bit processors: Intel 64 –
Cannon Lake microarchitecture=== ===64-bit processors: Intel 64 (10th generation) –
Ice Lake microarchitecture=== === 64-bit processors: Intel 64 (10th generation) –
Comet Lake microarchitecture === === 64-bit processors: Intel 64 (11th generation) –
Tiger Lake microarchitecture === === 64-bit processors: Intel 64 (12th generation) –
Alder Lake microarchitecture === === 64-bit processors: Intel 64 (13th and 14th generation) –
Raptor Lake microarchitecture === ===
Intel Tera-Scale=== • 2007:
Teraflops Research Chip, an 80 core processor prototype. • 2009:
Single-chip Cloud Computer, a research microprocessor containing the most Intel Architecture cores ever integrated on a silicon CPU chip: 48.
Intel Xeon Phi Manycore processors, originating from the cancelled
Larrabee processor. • 2010:
Knights Ferry (32-core processor prototype on 45nm) • 2012:
Knights Corner (Xeon Phi x100 series, with 57 to 61 cores on 22nm) • 2016:
Knights Landing (Xeon Phi x200 series, with 64 to 72 cores on 14nm; introduced
AVX-512) • 2017:
Knights Mill (Xeon phi x205 series, with 64 to 72 cores on 14nm; added improved support for deep learning)
Intel Atom Intel Quark A product line of SoCs and microcontrollers, targeting much lower size and power consumption than Intel Atom. • 2013:
Clanton (Quark X1000, SoC at 400 MHz,
i586 instruction set with x87) • 2015:
Silver Butte (Quark D1000, microcontroller at 32 MHz, runs reduced version of the IA-32 instruction set) • 2015:
Mint Valley (Quark D2000, microcontroller at 32 MHz,
i586 instruction set without x87) • 2015:
Atlas Peak (Quark SE C1000, microcontroller at 32 MHz.
i586 instruction set without x87) • 2017:
Sue Creek (Quark S1000, non-x86)
C&T F8680 The F8680 was an 80186-class
SoC originally developed by
Chips and Technologies, Inc. − after Intel acquired C&T in 1997, Intel continued shipments of this SoC until 2000.
Intel 805xx product codes Intel discontinued the use of part numbers such as 80486 in the marketing of mainstream x86-architecture processors with the introduction of the
Pentium brand in 1993. However, numerical codes, in the 805xx range, continued to be assigned to these processors for internal and part numbering uses. The following is a list of such product codes in numerical order:
Intel 806xx product codes Intel 807xx product codes ==See also==